| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Szx;
Application: Consumer Electronics;
Layers: Multilayer;
Solder Marsk: Green, Black, Blue, Red, Yellow, White;
Hole: Mechanical Hole, Laser Hole;
Assembly: Components;
Processing: SMT and DIP;
Surface Treatment: HASL, Immersion Gold, OSP;
Service Providing: PCB Production, PCB Assembly, Components Sourcing;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Copper Thickness: 1oz;
Surface Finishing: Lf-Hal;
Solder Mask Type: Red;
Silkscreen: White;
Board Thickness: 1.6mm;
Min. Hole Size: 0.2mm;
Min. Line Width: 0.15mm;
Certificates: UL, RoHS, SGS, ISO9001;
Min. Line Spacing: 0.15mm;
Shipping: DHL, UPS, TNT, FedEx, etc;
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Type: Rigid Circuit Board;
Dielectric: CEM-3;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Solder Mask: Green Blue Red White Biack etc;
Test: Aol;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Layer: 1 to 16;
Color: Green, White, Black, Ect;
Min Hole Size: 0.2mm;
Min Line Width: 0.1mm;
Min Line Spacing: 0.1mm;
Surface Finish: HASL, Immersion Gold, OSP;
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Type: Rigid Circuit Board;
Dielectric: CEM-3;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Cem-3;
Insulation Materials: Epoxy Resin;
Copper Thickness: 1oz;
Surface Finishing: :Immersion Tin/Sn, RoHS;
Solder Mask Type: Green;
Silkscreen: White;
Board Thickness: 560mm*460mm;
Min. Hole Size: 0.2mm;
Min. Line Width: Min. 5mil / 5mil;
Min. Line Spacing: Min. 5mil / 5mil;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
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Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Model: PCB;
Board Thickness: 0.21mm to 7.0mm;
Layer: 1 to 28 Layers;
Meterial Type: Fr-4, Cem-1, High Tg, Fr4 Halogen Free, Rogers;
Copper Thickness: 0.5oz to 5oz;
Min Hole Size: 0.2mm;
Min Line Width: 0.075mm;
Min Line Spacing: 0.075mm;
Solder Mask Color: Green.White, Blue, Ect;
Shipping: UPS, FedEx, DHL, Ect;
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