Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Szx;
Layers: Multilayer;
Surface Treatment: HASL, Immersion Gold, OSP,etc.;
Service Providing: PCB Production, PCB Assembly, Components Sourcing;
Solder Marsk: Green, Black, Blue, Red, Yellow, White etc.;
Hole: Mechanical Hole, Laser Hole;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Yldz;
Test: 100% E-Test;
Surface Treatment: 100% Tin;
Board Thickness: 0.2-6mm;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Solder Mask: Green;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
a Special Process: Carbon Film Printing;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Yldz;
Test: 100% E-Test;
Surface Treatment: 100% Tin;
Board Thickness: 0.2-6mm;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Solder Mask: Green;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
a Special Process: Carbon Film Printing;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Yldz;
Test: 100% E-Test;
Surface Treatment: 100% Tin;
Board Thickness: 0.2-6mm;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Solder Mask: Green;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
a Special Process: Carbon Film Printing;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Yldz;
Test: 100% E-Test;
Surface Treatment: 100% Tin;
Board Thickness: 0.2-6mm;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Solder Mask: Green;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
a Special Process: Carbon Film Printing;
|