Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Szx;
Application: Consumer Electronics;
Layers: Multilayer;
Solder Marsk: Green, Black, Blue, Red, Yellow, White;
Hole: Mechanical Hole, Laser Hole;
Assembly: Components;
Processing: SMT and DIP;
Surface Treatment: HASL, Immersion Gold, OSP;
Service Providing: PCB Production, PCB Assembly, Components Sourcing;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: HB;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: OEM/ODM;
PCB: PCB Board;
Copper Thickness: 0.5oz 1oz 2oz 3oz;
Line Width: 0.6mm;
Thinckness: 1.6mm;
Hole: Cover with Oil;
Service: SMT Aoi DIP Aging;
Packaging: ESD Bag;
Color: Black Green Red Yellow;
Application: Set Top Box Computer;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: HB;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: OEM/ODM;
PCB: PCB Board;
Copper Thickness: 0.5oz 1oz 2oz 3oz;
Line Width: 0.6mm;
Thinckness: 1.6mm;
Hole: Cover with Oil;
Service: SMT Aoi DIP Aging;
Packaging: ESD Bag;
Color: Black Green Red Yellow;
Application: Set Top Box Computer;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: HB;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Ckmcu;
Sku: 23097;
MOQ: 5;
Delivery Time: 7days;
Support Customization: Yes;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Model: PCB-D;
Brand: Xtl;
Copper Thickness: H/H0z-5/50z;
Board Thickness: 0.3mm - 3.2mm;
Surface Finishing: OSP,Immersion Gold,Immersion Tin,Immersion AG;
Maximum Layer: 12;
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