Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4, Fr-4;
Material: Polyester Glass Fiber Mat Laminate, Fiberglass Epoxy;
Application: Consumer Electronics, Consumer Electronics;
Flame Retardant Properties: V1, V2;
Processing Technology: Electrolytic Foil, Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper, Copper;
Insulation Materials: Epoxy Resin, Epoxy Resin;
Brand: Szx, Szx;
Type: Rigid Circuit Board;
Mechanical Rigid: Rigid;
Model: PCB;
Layers: Multilayer;
Solder Marsk: Green, Black, Blue, Red, Yellow, White;
Hole: Mechanical Hole, Laser Hole;
Assembly: Components;
Processing: SMT and DIP;
Surface Treatment: HASL, Immersion Gold, OSP;
Service Providing: PCB Production, PCB Assembly, Components Sourcing;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Fr4 Tg130;
Application: Communication;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: Fr4 Tg130;
Brand: Kb;
Board Thickness: 1.6mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Customized: Customized;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: R5775g;
Application: Communication;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: M6;
Brand: Panasonic;
Board Thickness: 2.0mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Customized: Customized;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: It180A;
Board Thickness: 1.6mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Customized: Customized;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: It180A;
Board Thickness: 1.6mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Customized: Customized;
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