| Specification |
Metal Coating: Silver;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Insulation Materials: Epoxy Resin;
Brand: Szx;
Surface Treatment: HASL, Immersion Gold, OSP, etc.;
Service Providing: PCB Production, PCB Assembly, Components Sourcing;
Solder Marsk: Green, Black, Blue, Red, Yellow, White etc.;
Hole: Mechanical Hole, Laser Hole;
|
Metal Coating: Tin;
Mode of Production: SMT & DIP;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr4, Al;
Copper Thickness: 1-6oz;
Color: Green, White, Black, Red, Yellow, Blue;
Parts: Original;
Test: 100% E-Test;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Delivery: PCB 3-9 Days; PCBA 2-3 Weeks;
MOQ: 1;
Application: Electronics Device;
Product Name: PCB PCBA;
Surface Finishing: HASL, Immersion Gold, OSP;
|
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Layer: 1L;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Board Thickness: 0.5mm-7.0mm;
Material: Fr-4, Cem-1/Cem-3, Pi,High Tg,Rogers;
Max Panel Size: 32"×48"(800mm×1200mm);
Min Hole Size: 0.02mm;
Min Line Width: 3mil(0.075mm);
Copper Thickness: 0.2-7.0oz;
Soldermask: Green/Yellow/Black/White/Red/Blue;
Silkscreen: Red/Yellow/Black/White;
Min Pad: 5mil(0.13mm);
Certificate: UL,ISO 9001,ISO14001,IATF16949;
Material Suppilers: Shengyi, Kb, Nanya, Iteq,etc.;
|
Metal Coating: Gold;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Layer: 1L;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Board Thickness: 0.5mm-7.0mm;
Material: Fr-4, Cem-1/Cem-3, Pi,High Tg,Rogers;
Max Panel Size: 32"×48"(800mm×1200mm);
Min Hole Size: 0.02mm;
Min Line Width: 3mil(0.075mm);
Copper Thickness: 0.2-7.0oz;
Soldermask: Green/Yellow/Black/White/Red/Blue;
Silkscreen: Red/Yellow/Black/White;
Min Pad: 5mil(0.13mm);
Certificate: UL,ISO 9001,ISO14001,IATF16949;
Material Suppilers: Shengyi, Kb, Nanya, Iteq,etc.;
|
Metal Coating: Gold;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Layer: 1L;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Board Thickness: 0.5mm-7.0mm;
Material: Fr-4, Cem-1/Cem-3, Pi,High Tg,Rogers;
Max Panel Size: 32"×48"(800mm×1200mm);
Min Hole Size: 0.02mm;
Min Line Width: 3mil(0.075mm);
Copper Thickness: 0.2-7.0oz;
Soldermask: Green/Yellow/Black/White/Red/Blue;
Silkscreen: Red/Yellow/Black/White;
Min Pad: 5mil(0.13mm);
Certificate: UL,ISO 9001,ISO14001,IATF16949;
Material Suppilers: Shengyi, Kb, Nanya, Iteq,etc.;
|
