| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Szx;
Type: Rigid Circuit Board;
Mechanical Rigid: Rigid;
Layers: Multilayer;
Solder Marsk: Green, Black, Blue, Red, Yellow, White;
Hole: Mechanical Hole, Laser Hole;
Assembly: Components;
Processing: SMT and DIP;
Surface Treatment: HASL, Immersion Gold, OSP;
Service Providing: PCB Production, PCB Assembly, Components Sourcing;
|
Structure: Double-Sided Rigid PCB, Multilayer Rigid PCB;
Dielectric: Fr-3, FR-4;
Material: Phenolic Paper Laminate, Polyester Glass Fiber Mat Laminate;
Application: Computer, Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process, Subtractive Process;
Base Material: Fr4, Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Material: Fr4;
Layers: 1 to 30 Layers;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Solder Mask: Green;
Silk Screen: White;
Surface Treatment: HASL Lead Free;
Test: 100%;
Lead Time: 6-8 Working Days;
Min. Line Width: 0.075mm;
|
Structure: Multilayer Rigid PCB, Double-Sided Rigid PCB;
Dielectric: FR-4, Fr-3;
Material: Polyester Glass Fiber Mat Laminate, Phenolic Paper Laminate;
Application: Consumer Electronics, Computer;
Flame Retardant Properties: V0, V0;
Processing Technology: Electrolytic Foil, Electrolytic Foil;
Production Process: Subtractive Process, Semi-Additive Process;
Base Material: Copper, Fr4;
Insulation Materials: Organic Resin, Organic Resin;
Brand: Fastline;
Board Material: Fr4;
Layers: 1 to 30 Layers;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Solder Mask: Green;
Silk Screen: White;
Surface Treatment: HASL Lead Free;
Test: 100%;
Lead Time: 6-8 Working Days;
Min. Line Width: 0.075mm;
|
Structure: Multilayer Rigid PCB, Double-Sided Rigid PCB;
Dielectric: FR-4, Fr-3;
Material: Polyester Glass Fiber Mat Laminate, Phenolic Paper Laminate;
Application: Consumer Electronics, Computer;
Flame Retardant Properties: V0, V0;
Processing Technology: Electrolytic Foil, Electrolytic Foil;
Production Process: Subtractive Process, Semi-Additive Process;
Base Material: Copper, Fr4;
Insulation Materials: Organic Resin, Organic Resin;
Brand: Fastline;
Board Material: Fr4;
Layers: 1 to 30 Layers;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Solder Mask: Green;
Silk Screen: White;
Surface Treatment: HASL Lead Free;
Test: 100%;
Lead Time: 6-8 Working Days;
Min. Line Width: 0.075mm;
|
Structure: Double-Sided Rigid PCB, Multilayer Rigid PCB;
Dielectric: Fr-3, FR-4;
Material: Phenolic Paper Laminate, Polyester Glass Fiber Mat Laminate;
Application: Computer, Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process, Subtractive Process;
Base Material: Fr4, Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Material: Fr4;
Layers: 1 to 30 Layers;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Solder Mask: Green;
Silk Screen: White;
Surface Treatment: HASL Lead Free;
Test: 100%;
Lead Time: 6-8 Working Days;
Min. Line Width: 0.075mm;
|
