Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Szx;
Application: Consumer Electronics;
Layers: Multilayer;
Solder Marsk: Green, Black, Blue, Red, Yellow, White;
Hole: Mechanical Hole, Laser Hole;
Assembly: Components;
Processing: SMT and DIP;
Surface Treatment: HASL, Immersion Gold, OSP;
Service Providing: PCB Production, PCB Assembly, Components Sourcing;
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Type: PCBA;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Fastline;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Material Type: Fr4;
Surface Treatment: HASL Lead Free;
Solder Mask: Green, Red, Blue, Black;
Silk Screen Color: White;
Board Layer: 2 Layer;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Lead Time: 5-7 Days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V1;
Mechanical Rigid: PCBA;
Processing Technology: Delay Pressure Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Model: PCB;
PCB: PCB Board;
Copper Thickness: 0.5oz 1oz 2oz 3oz;
Line Width: 0.6mm;
Thinckness: 1.6mm;
Hole: Cover with Oil;
Service: SMT Aoi DIP Aging;
Packaging: ESD Bag;
Color: Black Green Red Yellow;
Application: Set Top Box Computer;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V1;
Mechanical Rigid: PCBA;
Processing Technology: Delay Pressure Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: OEM PCBA;
PCB: PCB Board;
Copper Thickness: 0.5oz 1oz 2oz 3oz;
Line Width: 0.6mm;
Thinckness: 1.6mm;
Hole: Cover with Oil;
Service: SMT Aoi DIP Aging;
Packaging: ESD Bag;
Color: Black Green Red Yellow;
Application: Set Top Box Computer;
Layer: 30;
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Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model No.: Mobile Power PCB;
Copper Thickness: 1-20oz;
Solder Mask: Green/Black/White/Blue/Yellow/Red;
Surface Finish: HASL+Lf/ Immersion Gold/Tin/Silver/ Plating Gold;
Shipping: DHL, UPS, TNT, FedEx, etc;
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