COM Express Type 10 Mini Module Motherboard Cem311 for Axiomtek

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$150.00-350.00 / Piece

Sepcifications

  • Integrated Graphics Integrated Graphics
  • Main Chipset Intel
  • Maximum Memory Capacity 4G
  • Structure COM Express Type 10
  • Memory DDR3
  • SATA Interface SATA3.0
  • Printed Circuit Board Double Layers
  • Main Board Structure Integrated
  • Audio Effects Not HiFi
  • Transport Package Yes
  • Specification 84 x 55 mm
  • Trademark axiomtek
  • Origin Bj, Cn
  • with CPU Yes
  • Chipset Manufacturer Intel
  • Socket Type Onboard CPU
  • Chipset Soc Integrated
  • Memory Type DDR3
  • Item Condition New
  • Memory Channel Single
  • Memory Bank 1DDR3DIMM
  • Products Status New
  • Private Mold Yes
  • Ackage Yes
  • Launch Date 2019

Product Description

Ordering Information CEM311PG-N4200 (P/N-E38D311103) COM Express Type 10 compact module with Intel Pentium N4200, DDI/LVDS, USB 3.0 and GbE LAN CEM311PG-N3350 (P/N-E38D311100) COM Express Type 10 compact module with Intel Celeron N3350, DDI/LVDS, USB 3.0 and GbE LAN 7128D311000E CEM311 heat ...

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Chipset 2 USB 3.0 Motherboard Comparison
Transaction Info
Price US $ 150.00-350.00/ Piece US $ 52.00-60.00/ Piece US $ 70.00-100.00/ Piece US $ 120.00-123.00/ Piece US $ 70.00-100.00/ Piece
Min Order 1 Pieces 10 Pieces 1 Piece 1 Pieces 1 Piece
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification - ISO 9001, ISO 14000, IATF16949 ISO 9001 ISO 9001 ISO 9001
Trade Capacity
Export Markets - North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - US$10 Million - US$50 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million
Business Model - OEM, ODM, Own Brand(PaneSeen) OEM, ODM, Own Brand() OEM, ODM, Own Brand() OEM, ODM, Own Brand()
Average Lead Time - Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 4G;
Structure: COM Express Type 10;
Memory: DDR3;
SATA Interface: SATA3.0;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: Not HiFi;
with CPU: Yes;
Chipset Manufacturer: Intel;
Socket Type: Onboard CPU;
Chipset: Soc Integrated;
Memory Type: DDR3;
Item Condition: New;
Memory Channel: Single;
Memory Bank: 1DDR3DIMM;
Products Status: New;
Private Mold: Yes;
Ackage: Yes;
Launch Date: 2019;
Integrated Graphics: Integrated Board;
Main Chipset: Rk;
Maximum Memory Capacity: 128g;
Structure: ATX;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: Cortex-A55;
Printed Circuit Board: Eight Layers;
Main Board Structure: CPU Based;
Audio Effects: Not HiFi;
Network: Support RJ45;
USB: 7 Way USB (5*USB-2.0 Host, 1*USB3.0, 1*USB OTG);
Serial Port: 4-Way Serial Port (1*Uart Ttl, 2*Uart RS232, 1*Uar;
Io Port: 4*Io Port, Supporting Input or Output;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Structure: Mini Itx;
Memory: DDR3;
SATA Interface: SATA2.0;
CPU Socket: on-Board;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 16G;
Structure: Mini-ITX;
Memory: 2*DDR3;
SATA Interface: SATA3.0;
CPU Socket: Socket AM2/AM2+;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Warranty: 1year;
Condition: 100% Test;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Structure: Mini Itx;
Memory: DDR3;
SATA Interface: SATA2.0;
CPU Socket: on-Board;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Supplier Name

Beijing Teket Innovation Technology Company Limited

Gold Member Audited Supplier

Shenzhen Boxing World Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Elsky Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Elsky Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Elsky Technology Co., Ltd.

Diamond Member Audited Supplier