Cem322 COM Express Type 6 Compact Module Intel Pentium Motherboard for Axiomtek

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$150.00-350.00 / Piece

Sepcifications

  • Integrated Graphics Integrated Graphics
  • Main Chipset Intel
  • Maximum Memory Capacity 32G
  • Structure COM Express Type 6
  • Memory DDR4
  • SATA Interface SATA3.0
  • Printed Circuit Board Double Layers
  • Main Board Structure Circuit Baded
  • Audio Effects Not HiFi
  • Transport Package Std
  • Specification 95 x 95 mm
  • Trademark Axiomtek
  • Origin Bj. Cn
  • Chipset Manufacturer Intel
  • with CPU Yes
  • Socket Type Onboard CPU
  • Chipset Intel Atom X5 and X7
  • CPU Type Intel
  • Graphics Card Type Integrated
  • Maximum RAM Capacity 32GB
  • Hard Drive Interface SATA
  • Item Condition New
  • Memory Channel Double
  • Products Status New
  • Package Yes
  • Private Mold Yes
  • Application Server/Workstation
  • Launch Date 2020

Product Description

Company Profile Ordering Information CEM322-x6413E COM Express Type 6 Compact module with Intel Atom® x6413E, DDI, LVDS, 3.2 Gen1, and GbE LAN CEM322-J6426 COM Express Type 6 Compact module with Intel® Pentium® J6426, DDI, LVDS, 3.2 Gen1, and GbE LAN CEM322-x6425RE COM Express ...

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Intel Pentium Celeron Atom Comparison
Transaction Info
Price US $ 150.00-350.00/ Piece US $ 52.00-55.00/ Piece US $ 116.00-120.00/ Piece US $ 116.00-120.00/ Piece US $ 131.00-134.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram
Quality Control
Management System Certification - ISO 9001 ISO 9001 ISO 9001 ISO 9001
Trade Capacity
Export Markets - North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million
Business Model - OEM, ODM, Own Brand() OEM, ODM, Own Brand() OEM, ODM, Own Brand() OEM, ODM, Own Brand()
Average Lead Time - Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 32G;
Structure: COM Express Type 6;
Memory: DDR4;
SATA Interface: SATA3.0;
Printed Circuit Board: Double Layers;
Main Board Structure: Circuit Baded;
Audio Effects: Not HiFi;
Chipset Manufacturer: Intel;
with CPU: Yes;
Socket Type: Onboard CPU;
Chipset: Intel Atom X5 and X7;
CPU Type: Intel;
Graphics Card Type: Integrated;
Maximum RAM Capacity: 32GB;
Hard Drive Interface: SATA;
Item Condition: New;
Memory Channel: Double;
Products Status: New;
Package: Yes;
Private Mold: Yes;
Application: Server/Workstation;
Launch Date: 2020;
Integrated Graphics: Not Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 4G;
Structure: Mini-ITX;
Memory: DDR3;
SATA Interface: SATA2.0;
CPU Socket: LGA;
Printed Circuit Board: Six Layer;
Main Board Structure: Intel;
Audio Effects: HiFi;
CPU: D425/D525;
LAN: 1/2*LAN;
Integrated Graphics: Not Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 64G;
Structure: Mini-ITX;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: Intel;
Printed Circuit Board: Six Layer;
Main Board Structure: Intel;
Audio Effects: HiFi;
CPU: 6th Gen;7th Gen;8th Gen I3 I5 I7;
LAN: 1/2 LAN;
Mini Pcie: WiFi, Can Change to Support 4G/Bluetooth Modules;
Display: Intel® HD510/520;Intel® HD610/620;
Integrated Graphics: Not Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 16G;
Structure: Mini-ITX;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: Intel;
Printed Circuit Board: Six Layer;
Main Board Structure: Intel;
Audio Effects: HiFi;
CPU: 6th Gen 7th Gen I3 I5 I7;
LAN: 1/2 LAN;
Mini Pcie: WiFi, Can Be Changed to 3G/4G/Bluetooth Modules;
Display: Intel® HD510/520;Intel® HD610/620;
Hard Disk: Msata;SATA3.0;
Integrated Graphics: Not Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 64G;
Structure: Mini-ITX;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: Intel;
Printed Circuit Board: Six Layer;
Main Board Structure: Intel;
Audio Effects: HiFi;
CPU: I3-8100h ;I5-8300h ;I7-8700HK;I9-8950HK;I5-9300h;
LAN: 1/2*RJ45 LAN;
Mini Pcie: WiFi/4G/Bluetooth Modules;
Display: VGA//HDMI/Edp/Lvds;
Chipset: Hm370;
Supplier Name

Beijing Teket Innovation Technology Company Limited

Gold Member Audited Supplier

Shenzhen Elsky Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Elsky Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Elsky Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Elsky Technology Co., Ltd.

Diamond Member Audited Supplier