ROM-3310 Embedded Industrial Motherboards Rtx Ti Sitara Arm Am3352 Cortex-A8 on Board DDR31GHz Rtx2.0 Module for Advantech

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 unit US$80.00-200.00 / unit

Sepcifications

  • Integrated Graphics Integrated Graphics
  • Main Chipset Intel
  • Maximum Memory Capacity 512MB
  • Structure Rtx Module
  • Memory DDR3
  • SATA Interface SATA3.0
  • Printed Circuit Board Double Layers
  • Main Board Structure Integrated
  • Audio Effects Not HiFi
  • Transport Package Std
  • Specification 68 x 68 mm
  • Trademark Advantech
  • Origin Bj, Cn
  • with CPU Yes
  • Chipset Other
  • Fsb/Ht 2400
  • Socket Typeo Onboard CPU
  • CPU Type Intel
  • Aunch Date 2018
  • Hard Drive Interface SATA
  • Item Condition New
  • Memory Channel Double
  • Products Status New
  • Private Mold Yes
  • Application Server/Workstation

Product Description

Product Description Advantech Embedded Industrial Motherboards RTX ROM-3310 TI Sitara ARM AM3352 Cortex-A8 On board DDR3 1GHz RTX2.0 Module ROM-3310 TI Sitara™ ARM® AM3352 Cortex®-A8 Features 1GHz RTX2.0 Module TI Sitara™ ARM® AM3352 Cortex®-A8 1Ghz high ...

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Embedded Industrial Computer Comparison
Transaction Info
Price US $ 80.00-200.00/ unit US $ 158/ Piece US $ 164/ Piece US $ 181/ Piece US $ 138/ Piece
Min Order 1 unit 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification - ISO 9001, HSE, QHSE, EICC ISO 9001, HSE, QHSE, EICC ISO 9001, HSE, QHSE, EICC ISO 9001, HSE, QHSE, EICC
Trade Capacity
Export Markets - North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million
Business Model - OEM, ODM, Own Brand(Piesia) OEM, ODM, Own Brand(Piesia) OEM, ODM, Own Brand(Piesia) OEM, ODM, Own Brand(Piesia)
Average Lead Time - Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 512MB;
Structure: Rtx Module;
Memory: DDR3;
SATA Interface: SATA3.0;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: Not HiFi;
with CPU: Yes;
Chipset: Other;
Fsb/Ht: 2400;
Socket Typeo: Onboard CPU;
CPU Type: Intel;
Aunch Date: 2018;
Hard Drive Interface: SATA;
Item Condition: New;
Memory Channel: Double;
Products Status: New;
Private Mold: Yes;
Application: Server/Workstation;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Structure: Nano Motherboard;
Memory: DDR3;
SATA Interface: SATA2.0;
CPU Socket: BGA;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: HD Alc662;
CPU: Baytrail-I/D/M Serial Processor;
USB: 1*USB2.0 1*USB3.0;
LAN: 6*Intel I211at;
Display: HDMI1.4;
RAM: DDR3l 1066/1333MHz;
OS Support: Windows7 Windows8.1 Windows10 Linux;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Structure: Nuc Motherboard;
Memory: DDR3;
SATA Interface: SATA2.0;
CPU Socket: BGA;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: HD Alc662;
CPU: Baytrail-I/D/M Serial Processor;
USB: 1*USB2.0 1*USB3.0;
LAN: 4*Intel I211at;
Display: HDMI1.4;
RAM: DDR3l 1066/1333/1600MHz;
OS Support: Windows7 Windows8.1 Windows10 Linux;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Structure: Nano Motherboard;
Memory: DDR3;
SATA Interface: SATA2.0;
CPU Socket: BGA;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: HD Alc662;
CPU: Baytrail-I/D/M Serial Processor;
USB: 1*USB2.0 1*USB3.0;
LAN: 6*Intel I211at;
Display: HDMI1.4;
RAM: DDR3l 1066/1333MHz;
OS Support: Windows7 Windows8.1 Windows10 Linux;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 12GB;
Structure: Z-3.5inch Motherboard;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: BGA;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: HD Alc662;
CPU: Intel Qm77/Hm77 Chipest G3 Mobile Sandy/IVY Bridge;
USB: 2*USB 3.0 6*USB 2.0;
LAN: Support Pxe and Wakeup on LAN;
COM: 5*RS-232 1*RS422/485(Optional);
Power Supply: DC12V5a/7A;
Display: Synchronous or Asynchronous;
Additional: 1*SIM Card;
RAM: DDR3 1066/1333/1600MHz.;
Supplier Name

Beijing Teket Innovation Technology Company Limited

Gold Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

Diamond Member Audited Supplier