Qbip-8565A Qbip-8665A 3.5 Sub Compact Board with 8th Gen Intel Core I7-8565u 4COM 2SATA for Gigabyte

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 unit US$150.00-350.00 / unit

Sepcifications

  • Integrated Graphics Integrated Graphics
  • Main Chipset Intel
  • Maximum Memory Capacity 64G
  • Structure 3.5′′ Sbc
  • Memory DDR4
  • SATA Interface SATA3.0
  • Printed Circuit Board Double Layers
  • Main Board Structure Integrated
  • Audio Effects Not HiFi
  • Transport Package Std
  • Specification 465 x 351 x 217 (mm)
  • Trademark Gigabyte
  • Origin Bj, Cn
  • with CPU Yes
  • Chipset Other
  • Fsb/Ht 2400
  • Socket Type Onboard CPU
  • CPU Type Intel
  • Aunch Date 2018
  • Hard Drive Interface SATA
  • Item Condition New
  • Memory Channel Double
  • Products Status New
  • Private Mold Yes
  • Application Server/Workstation

Product Description

Product Description QBiP-8565A 3.5" SubCompact Board with 8th Generation Intel® Core™ i7-8565U Processor, Dual Channel DDR4 memory, 4 x COM, 2 x SATA 6Gb/s, 4 x USB 3.2 Gen 2x1, 2 x USB 2.0 Features 1. 3.5'' SBC 2. Intel® Core™ i7-8565U Processor 3. Dual Channel DDR4, 2 ...

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Sub Compact Wide Board Comparison
Transaction Info
Price US $ 150.00-350.00/ unit US $ 79.90-99.90/ Piece US $ 0.69-5.59/ Piece US $ 142.90-179.90/ Piece US $ 79.90-99.90/ Piece
Min Order 1 unit 10 Pieces 1 Pieces 2 Pieces 10 Pieces
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram T/T T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram
Quality Control
Product Certification - UL94V-0+RoHS - UL94V-0+RoHS UL94V-0+RoHS
Management System Certification - ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025 - ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025 ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025
Trade Capacity
Export Markets - North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - US$50 Million - US$100 Million - US$50 Million - US$100 Million US$50 Million - US$100 Million
Business Model - OEM, ODM OEM, ODM, Own Brand(Letine) OEM, ODM OEM, ODM
Average Lead Time - Off Season Lead Time: one month
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: one month
Peak Season Lead Time: one month
Off Season Lead Time: one month
Peak Season Lead Time: one month
Product Attributes
Specification
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 64G;
Structure: 3.5'' Sbc;
Memory: DDR4;
SATA Interface: SATA3.0;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: Not HiFi;
with CPU: Yes;
Chipset: Other;
Fsb/Ht: 2400;
Socket Type: Onboard CPU;
CPU Type: Intel;
Aunch Date: 2018;
Hard Drive Interface: SATA;
Item Condition: New;
Memory Channel: Double;
Products Status: New;
Private Mold: Yes;
Application: Server/Workstation;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 64G;
Structure: Mini-ITX;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: Onboard Processor;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: Standard;
Name: Industrial Mainboard;
Inspection: 100% IQC, Ipqc, Fqc, QA, Ict;
Advantages: Motherboard Manufacturer Since 2005;
Good Services: SMT, BGA and DIP;
Production Type: SMT & DIP & Assembling & Testing;
Services: OEM&ODM Manufacturer Since 2005;
Integrated Graphics: Integrated Graphics;
Main Chipset: Rk3399;
Maximum Memory Capacity: 4G;
Structure: ATX;
Memory: DDR3;
SATA Interface: SATA2.0;
CPU Socket: LGA 775;
Printed Circuit Board: Mrk3399gc;
Main Board Structure: CPU Based;
Audio Effects: Not HiFi;
Emmc: 2GB/4GB DDR,8g/16g/32g/64GB;
Interfaces: Integrated Two USB3.0 Interfaces;
Support: Extended TF Card;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 32G;
Structure: Mini-ITX;
Memory: DDR3;
SATA Interface: SATA2.0;
CPU Socket: Onboard Processor;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: Standard;
Name: Industrial Mainboard;
Inspection: 100% IQC, Ipqc, Fqc, QA, Ict;
Advantages: Motherboard Manufacturer Since 2005;
Good Services: SMT, BGA and DIP;
Production Type: SMT & DIP & Assembling & Testing;
Services: OEM&ODM Manufacturer Since 2005;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 64G;
Structure: Mini-ITX;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: Onboard Processor;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: Standard;
Name: Industrial Mainboard;
Inspection: 100% IQC, Ipqc, Fqc, QA, Ict;
Advantages: Motherboard Manufacturer Since 2005;
Good Services: SMT, BGA and DIP;
Production Type: SMT & DIP & Assembling & Testing;
Services: OEM&ODM Manufacturer Since 2005;
Supplier Name

Beijing Teket Innovation Technology Company Limited

Gold Member Audited Supplier

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Letine Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier