Specification |
Application: Promotion, Household, Chemical;
Feature: Moisture Proof, Recyclable, Bio-Degradable, Shock Resistance, Antistatic;
Material: Laminated Material;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Upright Bag;
4 Layers: Pet/Al/Ny/PE;
Thickness: 0.085-0.14 mm;
Peel Strength: >3.0n/ 15mm;
Puncture Resistance: >100n;
Applications: Electronics Components,Optical Lens;
Type: Flat, Cubic, Gusset, Ziplock;
Printing: Blank or Customized;
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Application: Electronic;
Feature: Moisture Proof, Antistatic;
Material: Laminated Material;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Upright Bag;
Material Structure: Antistatic Plastic Film with Black Conductive Ink;
Thickness: 0.08-0.16mm;
Purpose: Electronics, Conductor, PCB, Chip, etc;
OEM: Available;
Performance: Anti-Static, Moisture Barrier;
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Application: Electronic;
Feature: Moisture Proof, Antistatic;
Material: Laminated Material;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Upright Bag;
Material Structure: Antistatic Plastic Film with Black Conductive Ink;
Thickness: 0.08-0.16mm;
Purpose: Electronics, Conductor, PCB, Chip, etc;
OEM: Available;
Performance: Anti-Static, Moisture Barrier;
|
Application: Electronic;
Feature: Moisture Proof, Antistatic;
Material: Laminated Material;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Upright Bag;
Material Structure: Antistatic Plastic Film with Black Conductive Ink;
Thickness: 0.08-0.16mm;
Purpose: Electronics, Conductor, PCB, Chip, etc;
OEM: Available;
Performance: Anti-Static, Moisture Barrier;
|
Application: Electronic;
Feature: Moisture Proof, Antistatic;
Material: Laminated Material;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Upright Bag;
Material Structure: Antistatic Plastic Film with Black Conductive Ink;
Thickness: 0.08-0.16mm;
Purpose: Electronics, Conductor, PCB, Chip, etc;
OEM: Available;
Performance: Anti-Static, Moisture Barrier;
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