Aluminum Foil Bag

US$0.10-0.30 / Piece

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ESD Aluminum Foil Packing Bag Used in Semiconductor/PCB pictures & photos

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What is ESD Aluminum Foil Packing Bag Used in Semiconductor/PCB

Name: ESD Aluminum Foil Packing Bag Used in Semiconductor/PCB
Uploaded: 2023-04-04T14:09:43+08:00
Description: Recommended moisture-proof packaging solutions for you Moisture-proof vacuum bag, also known as Aluminum foil bag, Aluminum-plastic composite vacuum bag, vacuum bag, moisture-proof bag, using import

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Price

Min. Order Reference FOB Price

2000 Pieces US$0.10-0.30 / Piece

Sepcifications

Application Promotion, Household, Chemical, Industrial Use
Feature Moisture Proof, Recyclable, Shock Resistance, Antistatic, Dustproof
Material Laminated Material
Shape Seal Bag
Making Process Composite Packaging Bag
Raw Materials High Pressure Polyethylene Plastic Bag
Bag Variety Upright Bag
Transport Package Carton
Specification 22X25CM
Trademark TOPCOD/OEM
Origin Foshan China
Printing Blank or Customized
4 Layers Pet/Al/Ny/PE
Thickness 0.085-0.14 mm
Puncture Resistance >100n
Peel Strength >3.0n/ 15mm
Vapor Transmission 0.002mg/100 In2 /24h
Applications Electronics,PCB,Optical Lens, IC, LED,LCD
Pattern Flat,Cubic,Gusset,Ziplock

Product Description

Recommended moisture-proof packaging solutions for you Moisture-proof vacuum bag, also known as Aluminum foil bag, Aluminum-plastic composite vacuum bag, vacuum bag, moisture-proof bag, using imported high quality raw materials formed a production by automatic assembly line, the bag with a ...

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Foshan Shunde Topcod Industry Co., Ltd.

Diamond Member Since 2016

Audited Supplier

Business Type Manufacturer/Factory
Main Products Desiccant, Humidity Indicator Card, ESD Bag, Oxygen Absorber
Year of Establishment 2004-04-13
Registered Capital 295604.36 USD
Management System Certification ISO9001:2015
OEM/ODM Availability Yes

Aluminum Foil Bag Comparison

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Transaction Info
	Quick View ESD Aluminum Foil Packing Bag Used in Semiconductor/PCB Contact Now	Quick View ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing Contact Now	Quick View ESD Moisture Barrier Bag for Sensitive Product Packing Contact Now	Quick View Aluminum Foil Bag with Neutral Packing Sealing Bag Contact Now	Quick View ESD Aluminum Foil Bag with Neutral Packing Contact Now
Price	US $ 0.10-0.30/ Piece	US $ 0.30-0.40/ Square Meter	US $ 0.10-0.30/ Piece	US $ 0.10-0.30/ Piece	US $ 0.10-0.30/ Piece
Min Order	2000 Pieces	2000 Square Meters	2000 Pieces	2000 Pieces	2000 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Western Union	L/C, T/T, Western Union	T/T, Western Union	T/T, Western Union	T/T, Western Union
Quality Control
Management System Certification	ISO 9001, GMP	ISO 9001, GMP	ISO 9001, GMP	ISO 9001, GMP	ISO 9001, GMP
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic, Others	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic, Others	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic, Others	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic, Others	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic, Others
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Application: Promotion, Household, Chemical, Industrial Use; Feature: Moisture Proof, Recyclable, Shock Resistance, Antistatic, Dustproof; Material: Laminated Material; Shape: Seal Bag; Making Process: Composite Packaging Bag; Raw Materials: High Pressure Polyethylene Plastic Bag; Bag Variety: Upright Bag; Printing: Blank or Customized; 4 Layers: Pet/Al/Ny/PE; Thickness: 0.085-0.14 mm; Puncture Resistance: >100n; Peel Strength: >3.0n/ 15mm; Vapor Transmission: 0.002mg/100 In2 /24h; Applications: Electronics,PCB,Optical Lens, IC, LED,LCD; Pattern: Flat,Cubic,Gusset,Ziplock;	Application: Promotion, Household, Chemical, Industrial Use; Feature: Moisture Proof, Recyclable, Shock Resistance, Antistatic, Dustproof; Material: Laminated Material; Shape: Seal Bag; Making Process: Composite Packaging Bag; Raw Materials: High Pressure Polyethylene Plastic Bag; Bag Variety: Upright Bag; Printing: Blank or Customized; Layers: Pet/Al/Ny/PE; Thickness: 0.14mm, 0.2mm, etc; Puncture Resistance: >100n; Peel Strength: >3.0n/ 15mm;	Application: Promotion, Household, Chemical, Industrial Use; Feature: Moisture Proof, Recyclable, Shock Resistance, Antistatic, Dustproof; Material: Laminated Material; Shape: Seal Bag; Making Process: Composite Packaging Bag; Raw Materials: High Pressure Polyethylene Plastic Bag; Bag Variety: Upright Bag; Printing: Blank or Customized; 4 Layers: Pet/Al/Ny/PE; Thickness: O.14mm; Puncture Resistance: >100n; Peel Strength: >3.0n/ 15mm;	Application: Promotion, Household, Chemical, Industrial Use; Feature: Moisture Proof, Recyclable, Shock Resistance, Antistatic, Dustproof, Water Proof, Oxygen Isolative; Material: Laminated Material; Shape: Seal Bag; Making Process: Composite Packaging Bag; Raw Materials: High Pressure Polyethylene Plastic Bag; Bag Variety: Upright Bag; Printing: Blank or Customized; 4 Layers: Pet/Al/Ny/PE; Thickness: O.14mm; Puncture Resistance: >100n; Peel Strength: >3.0n/ 15mm; Range of Application: PC Board, Electronic Component Modem, CD-Driver; Standard: GB/T1037-1988, GB/T1038-2000, Mil-B-81705-C;	Application: Promotion, Household, Chemical, Industrial Use; Feature: Moisture Proof, Recyclable, Shock Resistance, Antistatic, Dustproof; Material: Laminated Material; Shape: Seal Bag; Making Process: Composite Packaging Bag; Raw Materials: High Pressure Polyethylene Plastic Bag; Bag Variety: Upright Bag; Printing: Blank or Customized; 4 Layers: Pet/Al/Ny/PE; Thickness: O.14mm; Puncture Resistance: >100n; Peel Strength: >3.0n/ 15mm; Range of Application: PC Board,Electronic Component Modem,CD-Driver; Standard: GB/T1037-1988,GB/T1038-2000,Mil-B-81705-C;
Supplier Name	Foshan Shunde Topcod Industry Co., Ltd.	Foshan Shunde Topcod Industry Co., Ltd.	Foshan Shunde Topcod Industry Co., Ltd.	Foshan Shunde Topcod Industry Co., Ltd.	Foshan Shunde Topcod Industry Co., Ltd.
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