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Small Lab Using Die Bonder dB100

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Price

Min. Order Reference FOB Price

1 Piece US$69,000.00-72,000.00 / Piece

Sepcifications

After-sales Service Online and Video Service
Condition New
Speed Medium Speed
Precision High Precision
Certification CE
Warranty 12 Months
Automatic Grade Semiautomatic
Type Medium-speed Chip Mounter
Transport Package Polywood Case
Specification 800 * 750 * 630mm
Trademark TERMWAY
Origin Beijing, China
Max. Chip Size Smaller 20mm X20mm(50*50mm Optional)
Min. Chip Size 0.2*0.2mm
Mounting Precision ±3um 3δ
Feeding Mode 2 Inch Waffle Box*2
Substrate Size 150*150mm
X Y Z Axis Motion System Roller Screw + Servo Motor
X Y Axis Resolution 0.1um
Power Supply 220V, 50Hz
Net Weight 150kg

Product Description

Small Lab Using Die Bonder DB100 DB100 is a manual-semi-automatic micro assembly placement system. The whole machine uses a marble motion platform to ensure that the entire motion accuracy reaches the sub-micron level. It comes with a laser height measurement system, which can meet the needs ...

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Termway (Beijing) Precision Technology Co., Ltd.

Diamond Member Since 2010

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products PCB Assembly, Pick&Place Machine, Reflow Oven/Wave Machine, Screen Printer, Dispenser
Year of Establishment 2012-07-31
Management System Certification ISO 9001, ISO 14001

Die Bonder Comparison

	Small Lab Using Die Bonder dB100 Contact Now	Quick View Ruibo Automatic IC Programming Machine for Chip Assembly/Production Line Contact Now	Quick View 8 Nozzles Automatic PCB LED Light Making Chip Mounting Machine SMT SMD Manufacturing Equipment Neoden10 Contact Now	Quick View High Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory Use Contact Now	Quick View Ruibo Nand Flash Automatic IC Programming Machine for Chips/Computer Contact Now

Transaction Info
	Small Lab Using Die Bonder dB100 Contact Now	Quick View Ruibo Automatic IC Programming Machine for Chip Assembly/Production Line Contact Now	Quick View 8 Nozzles Automatic PCB LED Light Making Chip Mounting Machine SMT SMD Manufacturing Equipment Neoden10 Contact Now	Quick View High Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory Use Contact Now	Quick View Ruibo Nand Flash Automatic IC Programming Machine for Chips/Computer Contact Now
Price	US $ 69,000.00-72,000.00/ Piece	US $ 26,500.00-30,000.00/ Set	US $ 19999/ Set	US $ 60,000.00-100,000.00/ Piece	US $ 26,500.00-30,000.00/ Set
Min Order	1 Pieces	1 Sets	1 Sets	1 Pieces	1 Sets
Payment Terms	T/T, Western Union, Paypal	L/C, T/T, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, Western Union, Paypal, Money Gram
Quality Control
Product Certification	CE	ISO, CE	CE	CE	ISO, CE
Management System Certification	ISO 9001, ISO 14001	ISO 9001	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000	-	ISO 9001
Trade Capacity
Export Markets	-	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$2.5 Million - US$5 Million	US$2.5 Million - US$5 Million	US$5 Million - US$10 Million	US$1 Million - US$2.5 Million	US$2.5 Million - US$5 Million
Business Model	Own Brand(TORCH)	OEM, ODM	ODM, Own Brand(NeoDen)	Own Brand(minder-hightech)	OEM, ODM
Average Lead Time	-	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	After-sales Service: Online and Video Service; Condition: New; Speed: Medium Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Semiautomatic; Type: Medium-speed Chip Mounter; Max. Chip Size: Smaller 20mm X20mm(5050mm Optional);* Min. Chip Size: 0.20.2mm;* Mounting Precision: ±3um 3δ; Feeding Mode: 2 Inch Waffle Box2;* Substrate Size: 150150mm;* X Y Z Axis Motion System: Roller Screw + Servo Motor; X Y Axis Resolution: 0.1um; Power Supply: 220V, 50Hz; Net Weight: 150kg;	After-sales Service: on-Site Teaching or Remote Instruction; Condition: New, New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: Ultra High-speed Chip Mounter; Production Scores: Multiple Varieties; Production Continuity: Continuous; Automation: Automatic; After-Sales Service: Overseas Service Center Available; PC Control: Use a USB Link, Suppert Offline Burning; Buring Seat: Dedicated Bounce Buring; Buring Efficiency: 3600/Burning Time(Sec +3)2;* Input Power: 220VAC 1# 3.0kw; Air Pressure: 0.4-0.6MPa 50L/Min; Drive Mode of Tape: Torque Motor Drive; Drive Mode of IC: SMC Rodless Cylinder Drive; Detectuve Product: Automatic Alarm; Extemal Control Interface: RS 232; Edit Mode: PC + Hand Control Box; X/Y Moving Range: 400400mm;* Moving Accuracy: +/-0.02mm; Conversational Style: Touchscreen; Gas Source: 4~8kg/Cm2; Control System: PLC;	After-sales Service: 2 Years Warranty; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Head Qty: 8; Feeder Qty: 65; Component Range: 0201, 0402, BGA, Qfn, Tqfp; Max. PCB Size: 540300mm (Under Single Phase);* Accuracy: 0.01mm; Power: 500W; Air Supply: >0.6MPa;	After-sales Service: 1 Year; Condition: New; Speed: High Speed; Precision: Precision; Warranty: 12 Months; Automatic Grade: Manual; Type: High-speed Chip Mounter;	After-sales Service: on-Site Teaching or Remote Instruction; Condition: New, New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: Ultra High-speed Chip Mounter; Production Scores: Multiple Varieties; Production Continuity: Continuous; Automation: Automatic; After-Sales Service: Overseas Service Center Available; PC Control: Use a USB Link, Suppert Offline Burning; Buring Seat: Dedicated Bounce Buring; Buring Efficiency: 3600/Burning Time(Sec +3)2;* Input Power: 220VAC 1# 3.0kw; Air Pressure: 0.4-0.6MPa 50L/Min; Drive Mode of Tape: Torque Motor Drive; Drive Mode of IC: SMC Rodless Cylinder Drive; Detectuve Product: Automatic Alarm; Extemal Control Interface: RS 232; Edit Mode: PC + Hand Control Box; X/Y Moving Range: 400400mm;* Moving Accuracy: +/-0.02mm; Conversational Style: Touchscreen; Gas Source: 4~8kg/Cm2; Control System: PLC;
Supplier Name	Termway (Beijing) Precision Technology Co., Ltd.	Dongguan Ruibo Automation Equipment Co., Ltd.	Zhejiang NeoDen Technology Co., Ltd.	Guangzhou Minder-Hightech co.,Ltd	Dongguan Ruibo Automation Equipment Co., Ltd.
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