PCB
US$1.20-1.90 / PCS
View
  • Recommend for you
  • What is Wonderful High Quality Aluminum Fr4 PCB Printed Wire Soldering Electronics Circuits Board Assembly Manufacturer in China
  • How does Smart Watch 94V0 PCB Electronics PCB Assembly Circuit Board Work
  • What is Laptop Main Board Electronics PCB with Green Solder Mask

What is Customized Flexible PCB for Lec Display FPC

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 PCS US$1.90

100-999 PCS US$1.60

1,000+ PCS US$1.20

Sepcifications

  • Type Flexible Circuit Board
  • Dielectric Pi
  • Material Fiberglass Epoxy Resin + Polyimide Resin
  • Application Medical Instruments
  • Flame Retardant Properties HB
  • Mechanical Rigid Fexible
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand UC
  • Transport Package Vacuum Packing
  • Specification IP class -2
  • Trademark Ucreate PCB
  • Origin Shenzhen
  • Copper Thickness 1oz
  • Surface Finihsing Immersion Gold
  • Lead Time 6-8 Working Days

Product Description

Welcome to Ucreate Ucreate is specialized in the production of a variety of single, double, high multi layers, HDI, the metallic substrate and FPC PCB. With laser drilling machine, CNC drilling machine, automatic machine, automatic exposure machine, large-scale lamination machine, Automatic ...

Learn More

PCB Comparison
Transaction Info
Price US $ 1.20-1.90/ PCS US $ 3.20-15.00/ Piece US $ 2.60-12.00/ Piece US $ 0.95-12.00/ Piece US $ 0.83-15.00/ Piece
Min Order 1 PCS 100 Pieces 100 Pieces 100 Pieces 100 Pieces
Payment Terms L/C, T/T, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue Above US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million
Business Model OEM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Flexible Circuit Board;
Dielectric: Pi;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: UC;
Copper Thickness: 1oz;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4 Shengyi Material;
Insulation Materials: Epoxy Resin;
Layer Count: 28layer Backplane;
Surface Finish: Immersion Gold;
Hole Wall Cu: Min. 25um;
Standard: Ipc II;
Certificates: RoHS CCC ISO;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4 Shengyi Material;
Insulation Materials: Epoxy Resin;
Layer Count: 16layer Through Hole Board;
Surface Finish: Immersion Gold;
Hole Wall Cu: Min. 25um;
Standard: Ipc II;
Certificates: RoHS CCC ISO;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4 Shengyi Material;
Insulation Materials: Epoxy Resin;
Layer Count: 4-12layer Through Hole Board;
Surface Finish: Immersion Gold;
Hole Wall Cu: Min. 20um;
Standard: Ipc II;
Certificates: RoHS CCC ISO;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4 Shengyi Material;
Insulation Materials: Epoxy Resin;
Layer Count: 4-18layer Through Hole Board;
Surface Finish: Immersion Gold;
Hole Wall Cu: Min. 20um;
Standard: Ipc II;
Certificates: RoHS CCC ISO;
Supplier Name

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier