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US$0.20-0.40 / Piece
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What is Fr-4+Pi 4L HDD R-F PCB Consumer Electronics FPC

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9 Pieces US$0.40

10+ Pieces US$0.20

Sepcifications

  • Structure Single-Sided FPC
  • Material Polyimide
  • Combination Mode Adhesive Flexible Plate
  • Conductive Adhesive Conductive Silver Paste
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand UC
  • Transport Package Vacuum
  • Specification UL(US&Canada). ISO. RoHs, TS, SGS
  • Trademark UC
  • Origin China
  • Board Layer 1
  • Board Thickness 0.15-0.2mm
  • Surface Treatment Enig
  • Size 500*8mm
  • Finished Copper Thickness 35um
  • Lead Time 7 Working Days
  • PCB Testing Flying Probe Testing/E-Testing
  • Fast Turn 3 Working Days
  • Ipc Standards Ipc-Class 2
  • Base Material Type Fr-4+Pi

Product Description

Welcome to Ucreate Ucreate is specialized in the production of a variety of single, double, high multi layers, HDI, the metallic substrate and FPC PCB. With laser drilling machine, CNC drilling machine, automatic machine, automatic exposure machine, large-scale lamination machine, Automatic ...

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PCB Comparison
Transaction Info
Price US $ 0.20-0.40/ Piece US $ 2.30-2.33/ Piece US $ 0.43-0.57/ Piece US $ 0.43-0.57/ Piece US $ 0.01-10.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1000 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM OEM, ODM OEM, ODM OEM, ODM OEM, ODM, Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Product Attributes
Specification
Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: UC;
Board Layer: 1;
Board Thickness: 0.15-0.2mm;
Surface Treatment: Enig;
Size: 500*8mm;
Finished Copper Thickness: 35um;
Lead Time: 7 Working Days;
PCB Testing: Flying Probe Testing/E-Testing;
Fast Turn: 3 Working Days;
Ipc Standards: Ipc-Class 2;
Base Material Type: Fr-4+Pi;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Mobile Phone;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V1;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: FL;
Board Material: Polyimide;
Board Thickness: 1.6 mm;
Copper Thickness: 1 Oz (35um);
Surface Treatment: HASL Lead Free;
Structure: Fr4;
Material: Fr4;
Combination Mode: SMT&DIP;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Epoxy Resin;
Board Material: Fr4;
Board Layer: 1;
Board Thickness: 0.1 mm;
Copper Thickness: 1 Oz;
Solser Mask: Yellow;
Silkscreen: White;
Surface Finishing: Enig;
Lead Time: 4-5 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB: Custom Design Product;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Epoxy Resin;
Board Material: Polyimide;
Board Layer: 2;
Board Thickness: 0.1 mm;
Copper Thickness: 1 Oz;
Solser Mask: Yellow;
Silkscreen: White;
Surface Finishing: Enig;
Lead Time: 4-5 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB Design: Customized Product;
Structure: FPC Connector;
Material: Thermoplastic;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Electronics;
Base Material: Copper;
Current Rating: 0.5AMP;
Insulation Resistance: 500mΩ Min;
Contact Resistance: 50mΩ Max;
Withstanding Voltage: AC 150V Min;
Operating Temperature: -40 Degree to +85 Degree;
Contact Material: Copper Alloy;
Contact Plating: Gold or Tin Over Nickel;
Insulation Material: Thermoplastic UL94V-0;
Color: Black;
Supplier Name

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Fastline Circuits Co., Limited

China Supplier - Gold Member Audited Supplier

Fastline Circuits Co., Limited

China Supplier - Gold Member Audited Supplier

Fastline Circuits Co., Limited

China Supplier - Gold Member Audited Supplier

SHENZHEN FORMAN PRECISION INDUSTRY CO., LTD.

China Supplier - Diamond Member Audited Supplier