PCB Board
US$2.20-3.10 / Piece
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What is Customized Multilayer China Factory Printed Circuit Board PCBA Assembly Service Multilayer PCB

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9 Pieces US$3.10

10-49 Pieces US$2.90

50+ Pieces US$2.20

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric CEM-3
  • Material Fiberglass Epoxy
  • Application Communication
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Brand UC
  • Transport Package Vacuum Package
  • Specification UL, RoHS, SGS, ISO9001
  • Trademark UC
  • Origin Shenzhen, China
  • Surface Finihsing Immersion Gold
  • Board Layer 2 Layers
  • Lead Time 6 Working Days

Product Description

Ucreate PCB's Aim: Customer Satisfaction is Always Our First Priority! *Quality Policy *Top Quality and high efficiency *Improve continuously *Achieve customer's satisfaction Technical Capabilities: Items Speci. Remark Max panel size 32" x ...

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PCB Board Comparison
Transaction Info
Price US $ 2.20-3.10/ Piece US $ 0.1/ Piece US $ 0.1/ Piece US $ 0.1/ Piece US $ 0.10-1.10/ Piece
Min Order 1 Pieces 100 Pieces 100 Pieces 100 Pieces 1 Pieces
Payment Terms L/C, T/T, D/P, Paypal T/T T/T T/T T/T, Western Union, Paypal, Money Gram
Quality Control
Product Certification - ISO/CQC/IATF/UL/RoHS ISO/CQC/IATF/UL/RoHS ISO/CQC/IATF/UL/RoHS ISO/Cqciatf/UL/RoHS/etc
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue Above US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million
Business Model OEM OEM, ODM, Own Brand(Unice) OEM, ODM, Own Brand(Unice) OEM, ODM, Own Brand(Unice) OEM, ODM, Own Brand(Unice)
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: CEM-3;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: UC;
Surface Finihsing: Immersion Gold;
Board Layer: 2 Layers;
Lead Time: 6 Working Days;
Type: Fr4;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: No Brand;
Layer: 1 to 20;
Board Thickness: Board Thickness;
Finished Inner Copper Thickness: H/H0z-4/40z;
Type: Fr4;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: No Brand;
Layer: 1 to 20;
Board Thickness: Board Thickness;
Finished Inner Copper Thickness: H/H0z-4/40z;
Type: Fr4;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: No Brand;
Layer: 1 to 20;
Board Thickness: Board Thickness;
Finished Inner Copper Thickness: H/H0z-4/40z;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Unice;
Layer: 1-20;
OEM/ODM: Support;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Testing: 100%;
Supplier Name

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

Gold Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

Gold Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

Gold Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

Gold Member Audited Supplier