Specification |
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: CEM-3;
Customized: Customized;
Condition: New;
Board Layer: 1L;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Board Thickness: 0.5mm-7.0mm;
Material: Fr-4, Cem-1/Cem-3, Pi,High Tg,Rogers;
Max Panel Size: 32"×48"(800mm×1200mm);
Min Hole Size: 0.02mm;
Min Line Width: 3mil(0.075mm);
Copper Thickness: 0.2-7.0oz;
Soldermask: Green/Yellow/Black/White/Red/Blue;
Silkscreen: Red/Yellow/Black/White;
Min Pad: 5mil(0.13mm);
Certificate: UL,ISO 9001,ISO14001,IATF16949;
Material Suppilers: Shengyi, Kb, Nanya, Iteq,etc.;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Non-Customized;
Condition: New;
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Metal Coating: Tin;
Mode of Production: SMT & DIP;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr4, Al;
Copper Thickness: 1-6oz;
Color: Green, White, Black, Red, Yellow, Blue;
Parts: Original;
Test: 100% E-Test;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Delivery: PCB 3-9 Days; PCBA 2-3 Weeks;
MOQ: 1;
Application: Electronics Device;
Product Name: PCB PCBA;
Surface Finishing: HASL, Immersion Gold, OSP;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Material Type: Fr-4/Htg150-180 Fr-4/Cem-1/Cem-3/Aluminum;
Board Thickness: 0.2mm--4.0mm;
Minimum Trace Width: 3mil;
Min Space Width: 4mil;
Min Drilling Dia: 0.2mm;
Pth Copper Thickness: 0.4-2mil(10-50um);
Tolerance of Eteching: ± 1mil(± 25um);
Surface Finish/Plating: HASL/Lead Free HASL/OSP/Gold Plating/Immersion Gol;
Tg Value: 130, 135, 140, 150, 170, 180;
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Metal Coating: Copper;
Mode of Production: DIP;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Non-Customized;
Condition: New;
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