Assembly PCB
US$0.85 - 1.56 / Piece

High Frequency PCBA Board PCB and Assembly Offer PCBA Assembly Service Video

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9 Pieces US$1.56

10-99 Pieces US$1.23

100+ Pieces US$0.85

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand UC
  • Transport Package Vacuum Package
  • Specification IPC class II
  • Trademark UC
  • Origin Shenzhen, China
  • Board Layer 6
  • Material Finished Thickness 1.6mm
  • Base Fr4
  • Special High Frequency PCB
  • Surface Treatment Immersion Gold/HASL Lead Free/ Immersion Silve
  • Solder Mask Color Green/White/Black/Blue/Red
  • Lead Time 8 Working Days
  • Certificate UL(Us&Canada). ISO9001. RoHS, Ts, SGS
  • PCB Testing E-Testing, Flying Probe Testing
  • Fast Turn 3 Working Days

Product Description

Welcome to Ucreate Ucreate is specialized in the production of a variety of single, double, high multi layers, HDI, the metallic substrate and FPC PCB. With laser drilling machine, CNC drilling machine, automatic machine, automatic exposure machine, large-scale lamination machine, Automatic flow ...

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Assembly PCB Comparison
Transaction Info
Price US$0.85 - 1.56 / Piece US$35.00 / Piece US$35.00 / Piece US$35.00 / Piece US$35.00 / Piece
Min Order 1 Piece 500 Pieces 500 Pieces 500 Pieces 500 Pieces
Payment Terms LC, T/T, D/P, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
Quality Control
Product Certification UL(Us&Canada). ISO9001. RoHS, Ts, SGS - - - -
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Southeast Asia North America, South America, Southeast Asia North America, South America, Southeast Asia North America, South America, Southeast Asia
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: 1-3 months
Off Season Lead Time: 3-6 months
Peak Season Lead Time: 1-3 months
Off Season Lead Time: 3-6 months
Peak Season Lead Time: 1-3 months
Off Season Lead Time: 3-6 months
Peak Season Lead Time: 1-3 months
Off Season Lead Time: 3-6 months
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: UC;
Board Layer: 6;
Material Finished Thickness: 1.6mm;
Base: Fr4;
Special: High Frequency PCB;
Surface Treatment: Immersion Gold/HASL Lead Free/ Immersion Silve;
Solder Mask Color: Green/White/Black/Blue/Red;
Lead Time: 8 Working Days;
PCB Testing: E-Testing, Flying Probe Testing;
Fast Turn: 3 Working Days;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Supplier Name

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier