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US$0.08-0.10 / PCS
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About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9 PCS US$0.10

10-99 PCS US$0.09

100+ PCS US$0.08

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Aerospace
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Immersional Gold
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand Ucreate PCB
  • Transport Package Vacuum Packing
  • Specification IPC-Class 2
  • Trademark Ucreate PCB
  • Origin Shenzhen China
  • Board Thickness 1.2~2.0mm
  • Surface Finihsing Immersional Gold
  • Lead Time 6-8 Working Days
  • Certificate ISO,UL,RoHS
  • PCB Testing E-Testing; Flying Probe Testing
  • Mask Ink Color White/Black/Green/Red/Yellow/Blue
  • Color Green Blue Red
  • Number of Layers Multilayer
  • Copper Thickness 2oz
  • Condition Original Made

Product Description

Welcome to Ucreate Ucreate is specialized in the production of a variety of single, double, high multi layers, HDI, the metallic substrate and FPC PCB. With laser drilling machine, CNC drilling machine, automatic machine, automatic exposure machine, large-scale lamination machine, Automatic ...

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Computer Parts Comparison
Transaction Info
Price US $ 0.08-0.10/ PCS US $ 35/ Piece US $ 35/ Piece US $ 35/ Piece US $ 35/ Piece
Min Order 1 PCS 500 Pieces 500 Pieces 500 Pieces 500 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, Western Union T/T, D/P, Western Union, Paypal T/T, D/P, Western Union, Paypal T/T, D/P, Western Union, Paypal T/T, D/P, Western Union, Paypal
Quality Control
Product Certification ISO,UL,RoHS - - - -
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, HSE
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Southeast Asia North America, South America, Southeast Asia North America, South America, Southeast Asia North America, South America, Southeast Asia
Annual Export Revenue - - - - -
Business Model OEM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: 3-6 Month(s)
Peak-season: 1-3 Month(s)
Off-season: 3-6 Month(s)
Peak-season: 1-3 Month(s)
Off-season: 3-6 Month(s)
Peak-season: 1-3 Month(s)
Off-season: 3-6 Month(s)
Peak-season: 1-3 Month(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersional Gold;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
PCB Testing: E-Testing; Flying Probe Testing;
Mask Ink Color: White/Black/Green/Red/Yellow/Blue;
Color: Green Blue Red;
Number of Layers: Multilayer;
Copper Thickness: 2oz;
Condition: Original Made;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Supplier Name

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

China Supplier - Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

China Supplier - Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

China Supplier - Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

China Supplier - Diamond Member Audited Supplier