Specification |
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Board Layer: 1-24;
Base Material Type: Fr4;
Material Finished Thickness: 1.6mm;
Finished Copper: All 1 Oz;
Surface Treatment: Immersion Gold/HASL Lead Free/OPS/ Immersion Silve;
Solder Mask Color: Green/White/Black/Blue/Red...;
Screen Color: White/Black/ Red...;
Lead Time: 5 Working Days;
PCB Testing: E-Testing; Flying Probe Testing;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Phenolic Paper Laminate;
Application: Aerospace;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Zitrok;
Quality Assurance: UL, Aoi, RoHS, ISO9001, 100% E-Test;
Material Stock: Fr4, Isola, Rogers, Ceramic, Arlon, Pi, Taconic;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Phenolic Paper Laminate;
Application: Aerospace;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Zitrok;
Quality Assurance: UL, Aoi, RoHS, ISO9001, 100% E-Test;
Material Stock: Fr4, Isola, Rogers, Ceramic, Arlon, Pi, Taconic;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Phenolic Paper Laminate;
Application: Aerospace;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Zitrok;
Quality Assurance: UL, Aoi, RoHS, ISO9001, 100% E-Test;
Material Stock: Fr4, Isola, Rogers, Ceramic, Arlon, Pi, Taconic;
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Dielectric: FR-4;
Quality Test: Aoi, 100% E-Test;
V- Cut Tolerance: +-10mi;
Bevel Edge: +-5mil;
Hole Location Tolerance: +-2mil;
Hole Diameter Tolerance: +-0.05mm;
Board Thickness Tolerance: +-5%;
Line Width/Space Tolerance: +-10%;
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