Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Ucreate PCB;
Copper Thickness: 2oz;
Surface Finishing: Immersion Gold PCB;
Solder Mask Type: Green;
Silkscreen: White;
Board Thickness: 1.6mm;
Min. Hole Size: 0.2mm;
Min. Line Width/Space: 0.1mm;
Test: Flying Probe and Fixture;
Certificates: UL, ISO, RoHS, Ts;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: OEM;
Product Type: Custom HDI 94V0 PCB;
PCB Type: Rigid PCB, Flexible PCB, Rigid-Flexible PCB;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Aluminum, Copper PCB;
Layer: 1, 2, 4, 6, up to 32 Layers;
Board Thickness: 0.2mm-8.0mm;
Copper Foil: 18um-210um(6oz);
Max. PCB Size: 22inch*22inch or 550mm*550mm;
Surface Finish/Treatment: HASL, Enig, OSP, Gold Plating, Golden Finger;
Solder Mask: Green/Black/White/Red/Blue/Yellow, etc;
Profiling Punching: Routing, V-Cut, Beveling, Chamfer;
SMT Jointing Capability: PCB Manufacturing, Components Sourcing and in-House;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functiona;
PCB Standard: ANSI/ESD, Ipc-a-610, Ipc-a-620;
Turnkey EMS: PCB Prototype, Compoments Sourcing, PCB Assembly;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
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