Specification |
Type: Flexible Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Pi;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Medical Instruments;
Mechanical Rigid: Fexible;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Uc;
Copper Thickness: 1oz;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
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Type: Combining Rigid Circuit Board;
Flame Retardant Properties: V2;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Mechanical Rigid: Rigid;
Material: Fiberglass Epoxy;
Circuit Board Type: Rigid, Flex;
Standard: 94V0 Circuit Board;
Moisture and Dust Prevention: Conformal Coating;
Testing: Aoi, X-ray, Spi, Fct, Ict;
Programming: Support;
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Type: Combining Rigid Circuit Board;
Flame Retardant Properties: V2;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Mechanical Rigid: Rigid;
Material: Fiberglass Epoxy;
Circuit Board Type: Rigid, Flex;
Standard: 94V0 Circuit Board;
Moisture and Dust Prevention: Conformal Coating;
Testing: Aoi, X-ray, Spi, Fct, Ict;
Programming: Support;
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Type: Combining Rigid Circuit Board;
Flame Retardant Properties: V2;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Mechanical Rigid: Rigid;
Material: Fiberglass Epoxy;
Circuit Board Type: Rigid, Flex;
Standard: 94V0 Circuit Board;
Moisture and Dust Prevention: Conformal Coating;
Testing: Aoi, X-ray, Spi, Fct, Ict;
Programming: Support;
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Type: Aluminium Core PCB;
Flame Retardant Properties: 94V-0;
Dielectric: Aluminum Core PCB;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: LED, Lamp, Lighting;
Mechanical Rigid: Aluminum Substrate PCB;
Material: Aluminum;
Brand: Finestpcb;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 18um, 35um, 70um, 105um, 140um;
Minimum Hole: 3/3mil;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
Thermal Conductivity: 1W, 2W, 2.5W, 3W, 8W, 12W;
PCB Thickness: 0.4~3.6mm;
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