PCB
US$0.10-0.50 / Piece
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What is Ucreate PCB Circuit Boards with ISO 9001

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9 Pieces US$0.10

10+ Pieces US$0.50

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Medical Instruments
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Uc
  • Transport Package Vacuum Pacakage
  • Specification UL(US&Canada). ISO9001. RoHs, TS, SGS
  • Trademark UC
  • Origin Shenzhen, China
  • Board Layer 1-24
  • Board Thickness 1.6mm
  • Soldermask Color Green/White/Black/Blue/Red/Purple…
  • Surface Finish Immersion Gold/HASL Lead Free/OPS/ Immersion Silve
  • Specialities Controlled Impedance
  • Base Material Type Fr4
  • Ipc Standards Ipc Class II
  • PCB Testing E-Testing, Flying Probe Testing
  • Lead Time 9 Working Days
  • Fast Turn 3 Working Days

Product Description

Welcome to Ucreate Ucreate is specialized in the production of a variety of single, double, high multi layers, HDI, the metallic substrate and FPC PCB. With laser drilling machine, CNC drilling machine, automatic machine, automatic exposure machine, large-scale lamination machine, Automatic ...

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PCB Comparison
Transaction Info
Price US $ 0.10-0.50/ Piece US $ 0.56-5.00/ Piece US $ 0.76-5.00/ Piece US $ 0.98-5.00/ Piece US $ 0.98-5.00/ Piece
Min Order 1 Pieces 10 Pieces 10 Pieces 10 Pieces 10 Pieces
Payment Terms L/C, T/T, Western Union, Paypal T/T, D/P, Paypal, Money Gram T/T T/T T/T
Quality Control
Product Certification - RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, IATF16949, ISO 13485 ISO 9001, IATF16949, ISO 13485 ISO 9001, IATF16949, ISO 13485 ISO 9001, IATF16949, ISO 13485
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe
Annual Export Revenue Above US$100 Million US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million
Business Model OEM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: one month
Peak Season Lead Time: 1-3 months
Off Season Lead Time: one month
Peak Season Lead Time: 1-3 months
Off Season Lead Time: one month
Peak Season Lead Time: 1-3 months
Off Season Lead Time: one month
Peak Season Lead Time: 1-3 months
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Board Layer: 1-24;
Board Thickness: 1.6mm;
Soldermask Color: Green/White/Black/Blue/Red/Purple…;
Surface Finish: Immersion Gold/HASL Lead Free/OPS/ Immersion Silve;
Specialities: Controlled Impedance;
Base Material Type: Fr4;
Ipc Standards: Ipc Class II;
PCB Testing: E-Testing, Flying Probe Testing;
Lead Time: 9 Working Days;
Fast Turn: 3 Working Days;
Type: Customized;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Customized;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Customized;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Customized;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Customized;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Customized;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Customized;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Customized;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Supplier Name

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier