PCB Board
US$0.10 / Piece

15 Year Facotry Multilayer Fr4 PCB Boards with RoHS Video

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

100 Pieces US$0.10 / Piece

Sepcifications

  • Type Fr4
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Computer
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Delay Pressure Foil
  • Base Material Fr4
  • Insulation Materials Organic Resin
  • Brand No Brand
  • Transport Package Bag
  • Specification BAG
  • Trademark Unice
  • Origin China Shenzhen
  • Certificate ISO/CQC/IATF/UL/RoHS
  • Layer 1 to 20
  • Board Thickness Board Thickness
  • Finished Inner Copper Thickness H/H0z-4/40z

Product Description

Product Description Company Profile Detailed Photos FAQ One Stop Service Fr4 PCB &PCB Assembly Providing one-stop service, from PCB manufactruring, components sourcing to PCA Assembly and PCBA test. PCB board manufacture and PCB assembly service: 1. PCB board file with parts ...

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Transaction Info
Price US $ 0.1/ Piece US $ 0.0001-99.00/ Piece US $ 8/ Piece US $ 8/ Piece US $ 0.03-10.00/ Piece
Min Order 100 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms T/T T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, D/P, Western Union, Paypal
Quality Control
Product Certification ISO/CQC/IATF/UL/RoHS - - - -
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, IATF16949 ISO 9001, IATF16949 ISO 9001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue US$50 Million - US$100 Million US$50 Million - US$100 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million US$1 Million - US$2.5 Million
Business Model OEM, ODM, Own Brand(Unice) OEM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
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Product Attributes
Specification
Type: Fr4;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: No Brand;
Layer: 1 to 20;
Board Thickness: Board Thickness;
Finished Inner Copper Thickness: H/H0z-4/40z;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Layers: 4 Layers;
Solder Mask: Green;
Legend: Write;
Surface Finish: Enig (2u'');
Thickness: 1.6mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File;
Material for PCB: Fr-4, High Tg Fr$, Halogen Free;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Supplier Name

Jian Unice Pcb Technique Co., Ltd

Gold Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Jia Cheng Electric Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Jia Cheng Electric Co., Ltd.

Diamond Member Audited Supplier

Shenzhen New Chip international Ltd

Gold Member Audited Supplier