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US$0.50-10.00 / Piece
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About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.50-10.00 / Piece

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Epoxy Resin
  • Application Communication
  • Processing Technology Electrolytic Foil
  • Production Process Immersion Gold
  • Base Material It180A
  • Transport Package Bubble Pack+Aluminum Foil Pack
  • Origin China
  • Board Thickness 1.6mm
  • Copper Thickness 2oz
  • Test Flying Probe & Fixture
  • Solder Mask Type Green
  • Min.Line Width/Space 0.1mm
  • Min. Hole Size 0.2mm
  • Certification RoHS, CCC, ISO, EPA
  • Customized Customized

Product Description

Detailed Photos In strict accordance with the drilling process PIN - drilling - check control hole quality; Exquisite copper sinking process to produce high quality printed circuit boards to meet various application requirements. PCB copper sinking process beyond customer requirements. Rigid ...

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OEM Comparison
Transaction Info
Price US $ 0.50-10.00/ Piece US $ 0.967-8.58/ Piece US $ 0.55-3.69/ Piece US $ 2.12-9.37/ Piece US $ 1.56-13.90/ Piece
Min Order 1 Pieces 100 Pieces 100 Pieces 100 Pieces 100 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Product Certification RoHS, CCC, ISO, EPA - - - -
Management System Certification ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, Europe, Southeast Asia/ Mideast North America, Europe, Southeast Asia/ Mideast North America, Europe, Southeast Asia/ Mideast North America, Europe, Southeast Asia/ Mideast
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: It180A;
Board Thickness: 1.6mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Customized: Customized;
Structure: HDI PCB;
Dielectric: Fr4 Em825 1.0mm;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Blind&Buried Vias;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: 4layer - 18layer;
HDI Structure: 1+N+1 to Any Layer;
Min. Trace/Space: 2/2mil;
Blind/Buried Vias: 0.1mm Laser Drilling;
Structure: HDI PCB;
Dielectric: Fr4 It158 0.8mm;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Blind&Buried Vias;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: 4layer - 18layer;
HDI Structure: 1+N+1 to Any Layer;
Min. Trace/Space: 2/2mil;
Blind/Buried Vias: 0.1mm Laser Drilling;
Structure: HDI PCB;
Dielectric: Fr4 Em825 1.2mm;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Blind&Buried Vias;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: 6layer - 8layer;
HDI Structure: 1+N+1 to Any Layer;
Min. Trace/Space: 2/2mil;
Blind/Buried Vias: 0.1mm Laser Drilling;
Unit Size: 242mm X 165mm;
Structure: HDI PCB;
Dielectric: Fr4 Em825 1.2mm;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Blind&Buried Vias;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: 6layer - 8layer;
HDI Structure: 1+N+1 to Any Layer;
Min. Trace/Space: 2/2mil;
Blind/Buried Vias: 0.1mm Laser Drilling;
Other: Resin Plugged;
Supplier Name

Usun Electronics Limited.,

China Supplier - Gold Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier