Quick Turn PCB
US$0.50-10.00 / Piece
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What is Custom Made PCB Prototyping Control Mainboard PCBA Factory

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.50-10.00 / Piece

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Epoxy Resin
  • Application Communication
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Immersion Gold
  • Base Material S1000-2m/It180A
  • Transport Package Bubble Pack+Aluminum Foil Pack
  • Specification 160mm*265mm
  • Origin China
  • Layers 12L
  • Board Thickness 1.6mm
  • Copper Thickness 1.5oz
  • Test Flying Probe & Fixture
  • Solder Mask Type Blue
  • Silkscreen Type White
  • Min.Line Width/Space 0.1mm
  • Min. Hole Size 0.2mm
  • Surface Finish Enig 3u"
  • X-Outs Allowed Not Allowed
  • Standard Ipc Class 3
  • Certification RoHS, CCC, ISO, EPA
  • Customized Customized

Product Description

Detailed Photos In strict accordance with the drilling process PIN - drilling - check control hole quality; Exquisite copper sinking process to produce high quality printed circuit boards to meet various application requirements. PCB copper sinking process beyond customer requirements. Rigid ...

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Quick Turn PCB Comparison
Transaction Info
Price US $ 0.50-10.00/ Piece US $ 1.50-2.50/ PCS US $ 4.00-6.90/ PCS US $ 0.06-0.08/ PCS US $ 0.06-0.08/ PCS
Min Order 1 Pieces 1 PCS 1 PCS 1 PCS 1 PCS
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Paypal L/C, T/T, D/P, Paypal L/C, T/T, D/P, Paypal L/C, T/T, D/P, Paypal
Quality Control
Product Certification RoHS, CCC, ISO, EPA - - - -
Management System Certification ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue Above US$100 Million Above US$100 Million Above US$100 Million Above US$100 Million Above US$100 Million
Business Model OEM, ODM, Own Brand() OEM OEM OEM OEM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: S1000-2m/It180A;
Layers: 12L;
Board Thickness: 1.6mm;
Copper Thickness: 1.5oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Blue;
Silkscreen Type: White;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Surface Finish: Enig 3u";
X-Outs Allowed: Not Allowed;
Standard: Ipc Class 3;
Customized: Customized;
Structure: Single-Sided Rigid PCB;
Dielectric: AIN;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Surface Finihsing: Immersion/ Chemical Gold;
Board Layer: 1 Layers;
Lead Time: 6 Working Days;
Structure: Single-Sided Rigid PCB;
Dielectric: AIN;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Surface Finihsing: Lf HASL;
Board Layer: 1 Layers;
Lead Time: 6 Working Days;
Structure: Single-Sided Rigid PCB;
Dielectric: AIN;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Ucreate;
Surface Finihsing: Lf HASL;
Board Layer: 1 Layers;
Lead Time: 6 Working Days;
Structure: Single-Sided Rigid PCB;
Dielectric: CEM-3;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Ucreate;
Surface Finihsing: Lf HASL;
Board Layer: 1 Layers;
Lead Time: 6 Working Days;
Supplier Name

Usun Electronics Limited.,

Gold Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier