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Customized Made Medical Device PCB PCBA Motherboard pictures & photos

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What is Customized Made Medical Device PCB PCBA Motherboard

Name: Customized Made Medical Device PCB PCBA Motherboard
Uploaded: 2024-06-14T10:53:56+08:00
Description: Detailed Photos In strict accordance with the drilling process PIN - drilling - check control hole quality; Exquisite copper sinking process to produce high quality printed circuit boards to meet v

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.50-10.00 / Piece

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Epoxy Resin
Application Communication
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Immersion Gold
Base Material S1000-2m/It180A
Transport Package Bubble Pack+Aluminum Foil Pack
Specification 175mm*325mm
Origin China
Layers 10L
Board Thickness 1.6mm
Copper Thickness 2oz
Test Flying Probe & Fixture
Solder Mask Type Green
Silkscreen Type White
Min.Line Width/Space 0.1mm
Min. Hole Size 0.1mm
Surface Finish Enig 2u"
X-Outs Allowed Not Allowed
Standard Ipc Class 2
Certification RoHS, CCC, ISO, EPA
Customized Customized

Product Description

Detailed Photos In strict accordance with the drilling process PIN - drilling - check control hole quality; Exquisite copper sinking process to produce high quality printed circuit boards to meet various application requirements. PCB copper sinking process beyond customer requirements. Rigid ...

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Usun Electronics Limited.,

Gold Member Since 2023

Audited Supplier

Business Type Trading Company
Main Products Yes
Management System Certification ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000
Export Year 2013-05-23
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
OEM/ODM Availability Yes

Quick Turn PCB Comparison

	Customized Made Medical Device PCB PCBA Motherboard Contact Now	Quick View Finish Enig+Gold Fingers 30u Impedance Control 100ohm 8layer PCB Contact Now	Quick View 8layer 1.0mm Enig with BGA to Line 3mil Inner Core Material 0.1mm Motherboard PCB Contact Now	Quick View 8layer 1.0mm OSP Pad in Via 0.2mm, Impedance Control Min. Space 4mil Circuit Board PCB Contact Now	Quick View 8layer 1.6mm Enig Min. Hole to Line 7.3mil Impedance Control Power Board PCB Contact Now

Transaction Info
	Customized Made Medical Device PCB PCBA Motherboard Contact Now	Quick View Finish Enig+Gold Fingers 30u Impedance Control 100ohm 8layer PCB Contact Now	Quick View 8layer 1.0mm Enig with BGA to Line 3mil Inner Core Material 0.1mm Motherboard PCB Contact Now	Quick View 8layer 1.0mm OSP Pad in Via 0.2mm, Impedance Control Min. Space 4mil Circuit Board PCB Contact Now	Quick View 8layer 1.6mm Enig Min. Hole to Line 7.3mil Impedance Control Power Board PCB Contact Now
Price	US $ 0.50-10.00/ Piece	US $ 0.48-5.90/ Piece	US $ 0.24-3.20/ Piece	US $ 0.26-3.40/ Piece	US $ 0.22-2.85/ Piece
Min Order	1 Pieces	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Product Certification	RoHS, CCC, ISO, EPA	-	-	-	-
Management System Certification	ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	Above US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million
Business Model	OEM, ODM, Own Brand()	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Resin; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Immersion Gold; Base Material: S1000-2m/It180A; Layers: 10L; Board Thickness: 1.6mm; Copper Thickness: 2oz; Test: Flying Probe & Fixture; Solder Mask Type: Green; Silkscreen Type: White; Min.Line Width/Space: 0.1mm; Min. Hole Size: 0.1mm; Surface Finish: Enig 2u"; X-Outs Allowed: Not Allowed; Standard: Ipc Class 2; Customized: Customized;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Immersion Gold+Gold Fingers; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 8L; BGA Gap: 3mil; Other: Impedance Control;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Immersion Gold; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 8L; BGA Gap: 3mil; Inner Core Material: 0.1mm;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: OSP; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 8L; Pad in Via: 0.2mm; Other: Impedance Control;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 8L; Min. Hole to Line: 7.3mil; Other: Impedance Control;
Supplier Name	Usun Electronics Limited.,	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.
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