What is PCB PCBA Inverter Amplifier PCB Board Fabrication Printed Circuit Board

Name: PCB PCBA Inverter Amplifier PCB Board Fabrication Printed Circuit Board
Uploaded: 2023-11-03T20:48:36+08:00
Description: Detailed Photos In strict accordance with the drilling process PIN - drilling - check control hole quality; Exquisite copper sinking process to produce high quality printed circuit boards to meet v

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.50-10.00 / Piece

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Epoxy Resin
Application Communication
Processing Technology Electrolytic Foil
Production Process HASL Enig
Base Material It180A S1000-2 Tu768
Transport Package Bubble Pack+Aluminum Foil Pack
Origin China
Board Thickness 1.6mm
Copper Thickness 2oz
Test Flying Probe & Fixture
Solder Mask Type Green
Min.Line Width/Space 0.1mm
Min. Hole Size 0.2mm
Certification RoHS, CCC, ISO, EPA
Customized Customized

Product Description

Detailed Photos In strict accordance with the drilling process PIN - drilling - check control hole quality; Exquisite copper sinking process to produce high quality printed circuit boards to meet various application requirements. PCB copper sinking process beyond customer requirements. Rigid ...

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Usun Electronics Limited.,

Gold Member Since 2023

Audited Supplier

Business Type Trading Company
Main Products Yes
Management System Certification ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000
Export Year 2013-05-23
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
OEM/ODM Availability Yes

Fabrication Comparison

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Transaction Info
	PCB PCBA Inverter Amplifier PCB Board Fabrication Printed Circuit Board Contact Now	Quick View IP Small CCTV Camera PCB Assembly PCBA Printed Circuit Board PCBA Contact Now	Quick View IP Small CCTV Camera PCB Assembly PCBA Printed Circuit Board PCBA Contact Now	Quick View 5port Gigabit Poe Switch Module PCBA Transmission Rate 10/100/1000Mbps Main Chip Rtl8367 IEEE802.3af/at Standard Contact Now	Quick View 4+1 Port Gigabit Ethernet Switch PCB Module Assembly Contact Now
Price	US $ 0.50-10.00/ Piece	US $ 0.50-1.90/ Piece	US $ 0.50-1.90/ Piece	US $ 0.50-1.00/ Piece	US $ 0.50-1.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	2 Pieces	2 Pieces
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T	T/T	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification	RoHS, CCC, ISO, EPA	-	-	-	-
Management System Certification	ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000	ISO 9001, ISO 14000, IATF16949, GMP	ISO 9001, ISO 14000, IATF16949, GMP	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe	North America, Eastern Europe, Africa, Mid East, Western Europe	North America, Eastern Europe, Africa, Mid East, Western Europe	-	-
Annual Export Revenue	Above US$100 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million	-	-
Business Model	OEM, ODM, Own Brand()	OEM, ODM, IMS service	OEM, ODM, IMS service	-	-
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	-	-
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Resin; Application: Communication; Processing Technology: Electrolytic Foil; Production Process: HASL Enig; Base Material: It180A S1000-2 Tu768; Board Thickness: 1.6mm; Copper Thickness: 2oz; Test: Flying Probe & Fixture; Solder Mask Type: Green; Min.Line Width/Space: 0.1mm; Min. Hole Size: 0.2mm; Customized: Customized;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Board Material: Fr4, H-Tg, It-180A, Cem, Aluminum; Board Thickness: 0.4-5.0mm; Solder Mask Color: Green, White, Black, Blue, Yellow, Red, Purple; Silkscreen Color: Green, White, Black, Blue, Yellow; Copper Thickness: 0.5-10 Oz; Layer: 1-60 Layers; Min. SMD Size: 01005; Surface Finishing: HASL, Lf HASL, Enig, OSP, Carbon Oil; Testing: E-Test, Fly Probe Test, Visual Checking,Aoi,X-ray; MOQ: 1PCS; Service: Turnkey PCB Assembly Service; PCBA Test: Aoi, in-Circuit Test (Ict), Functioal Test (Fct); PCB Max. Board Size: 6201100mm;* Certificates: UL (E503048),ISO9001/ISO14001/IATF16949/ISO13485;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Board Material: Fr4, H-Tg, It-180A, Cem, Aluminum; Board Thickness: 0.4-5.0mm; Solder Mask Color: Green, White, Black, Blue, Yellow, Red, Purple; Silkscreen Color: Green, White, Black, Blue, Yellow; Copper Thickness: 0.5-10 Oz; Layer: 1-60 Layers; Min. SMD Size: 01005; Surface Finishing: HASL, Lf HASL, Enig, OSP, Carbon Oil; Testing: E-Test, Fly Probe Test, Visual Checking,Aoi,X-ray; MOQ: 1PCS; Service: Turnkey PCB Assembly Service; PCBA Test: Aoi, in-Circuit Test (Ict), Functioal Test (Fct); PCB Max. Board Size: 6201100mm;* Certificates: UL (E503048),ISO9001/ISO14001/IATF16949/ISO13485;	Structure: Double-Sided Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin;	Structure: Double-Sided Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin;
Supplier Name	Usun Electronics Limited.,	Shenzhen Jingxin Electronic Technology Co., Ltd.	Shenzhen Jingxin Electronic Technology Co., Ltd.	Shenzhen Yongchangtai Electronics Co., Ltd.	Shenzhen Yongchangtai Electronics Co., Ltd.
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