Mcp2515
US$2.10 - 2.18 / Piece
Mcp2515 Can Bus Module Tja1050 Receiver Spi Protocol 51 MCU Program Routine pictures & photos
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Mcp2515 Can Bus Module Tja1050 Receiver Spi Protocol 51 MCU Program Routine pictures & photos
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Mcp2515 Can Bus Module Tja1050 Receiver Spi Protocol 51 MCU Program Routine pictures & photos
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Mcp2515 Can Bus Module Tja1050 Receiver Spi Protocol 51 MCU Program Routine pictures & photos
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Mcp2515 Can Bus Module Tja1050 Receiver Spi Protocol 51 MCU Program Routine pictures & photos
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Mcp2515 Can Bus Module Tja1050 Receiver Spi Protocol 51 MCU Program Routine pictures & photos
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What is Mcp2515 Can Bus Module Tja1050 Receiver Spi Protocol 51 MCU Program Routine

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Price

Purchase Qty. Reference FOB Price

10-49 Pieces US$2.18

50+ Pieces US$2.10

Product Description

Original integrated circuit :Mcp2515 Can Bus Module Manufacturer: Original Manufacturer Part Number: Mcp2515 Can Bus Module Product Category: Module RoHS: Lead free / RoHS Compliant Supply Long-term Supply Packaging: Original Factory Sealed Packing: tape &reel / tube &box/ tray &box/ ...

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Mcp2515 Comparison

Mcp2515 Can Bus Module Tja1050 Receiver Spi Protocol 51 MCU Program Routine

Mcp2515 Can Bus Module Tja1050 Receiver Spi Protocol 51 MCU Program Routine

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Transaction Info
Price US$2.10 - 2.18 / Piece US$0.10 - 1.50 / Piece US$0.10 - 1.50 / Piece US$0.10 - 1.50 / Piece US$0.10 - 1.50 / Piece
Min Order 10 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T, PayPal T/T T/T T/T T/T
Quality Control
Management System Certification Others - - - -
Trade Capacity
Export Markets South America, Europe North America, South America, Eastern Europe, Southeast Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Kevis;
Layer: 1-64 Layers;
Board Thickness: 0.2mm-7.0mm;
Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
Min. Hole Size: 0.15mm;
Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold;
Solder Mask Color: Green, Blue, Yellow, White, Black;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Kevis;
Layer: 1-64 Layers;
Board Thickness: 0.2mm-7.0mm;
Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
Min. Hole Size: 0.15mm;
Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold;
Solder Mask Color: Green, Blue, Yellow, White, Black;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Kevis;
Layer: 1-64 Layers;
Board Thickness: 0.2mm-7.0mm;
Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
Min. Hole Size: 0.15mm;
Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold;
Solder Mask Color: Green, Blue, Yellow, White, Black;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Kevis;
Layer: 1-64 Layers;
Board Thickness: 0.2mm-7.0mm;
Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
Min. Hole Size: 0.15mm;
Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold;
Solder Mask Color: Green, Blue, Yellow, White, Black;
Supplier Name

Shenzhen Wonderwing Electronics., Ltd.

Gold Member Audited Supplier

Guangzhou Kevis Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Guangzhou Kevis Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Guangzhou Kevis Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Guangzhou Kevis Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

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