Polyurethane Hot Melt Adhesive Used in Electronic and Microelectronic Industries for Bonding Plastic Substrates Video

Name: Polyurethane Hot Melt Adhesive Used in Electronic and Microelectronic Industries for Bonding Plastic Substrates
Uploaded: 2022-08-08T15:57:17+08:00
Description: EG-1013 is polyurethane based hot melt adhesive which can be used in electronic and microelectronic industries. Product Description Wuxi East Group has many kinds of electronic adhesive. EG-1013

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About this Item

Price

Purchase Qty. Reference FOB Price

30-2,999 ml US$0.50

3,000-14,999 ml US$0.48

15,000+ ml US$0.45

Sepcifications

Morphology Solid-State
Application Electronic Product
Material Polyurethane
Classification Hot Melt
Color White
Transport Package Pail
Specification 30ml
Trademark EG
Origin China

Product Description

EG-1013 is polyurethane based hot melt adhesive which can be used in electronic and microelectronic industries. Product Description Wuxi East Group has many kinds of electronic adhesive. EG-1013 is polyurethane based hot melt adhesive which can be used in electronic and microelectronic ...

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Wuxi East Group Trading Co., Ltd.

Gold Member Since 2021

Audited Supplier

Business Type Manufacturer/Factory, Trading Company, Group Corporation
Main Products Glue, Adhesive, Vacuum Glue, Hot Melt Glue
Registered Capital 3000000 RMB
Plant Area 33300 square meters
Management System Certification ISO 9001, ISO 14001
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Adhesive Comparison

	Quick View Polyurethane Hot Melt Adhesive Used in Electronic and Microelectronic Industries for Bonding Plastic Substrates Contact Now	Vinyl Copolymer Resin Um55 Same as Dow (Vyhh) for Ink, Coating / Adhesive/Print Contact Now	Quick View Exterior and Interior Decoration Colored Sand Epoxy Grout Contact Now	Quick View Tile Gap Filling and Sealing Epoxy Colored Sand Tile Grout Contact Now	Quick View Beutifull Colored Sand Epoxy Tile Grout Contact Now

Transaction Info
	Quick View Polyurethane Hot Melt Adhesive Used in Electronic and Microelectronic Industries for Bonding Plastic Substrates Contact Now	Vinyl Copolymer Resin Um55 Same as Dow (Vyhh) for Ink, Coating / Adhesive/Print Contact Now	Quick View Exterior and Interior Decoration Colored Sand Epoxy Grout Contact Now	Quick View Tile Gap Filling and Sealing Epoxy Colored Sand Tile Grout Contact Now	Quick View Beutifull Colored Sand Epoxy Tile Grout Contact Now
Price	US $ 0.45-0.50/ ml	US $ 1,600.00-1,700.00/ Ton	Negotiable	Negotiable	Negotiable
Min Order	30 ml	1 Tons	1000 Pieces	1000 Pieces	1000 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Paypal	T/T	L/C, T/T, Western Union, Cash	L/C, T/T, Western Union, Cash	L/C, T/T, Western Union, Cash
Quality Control
Management System Certification	ISO 9001, ISO 14001	ISO 9001, ISO 14001	ISO 9001	ISO 9001	ISO 9001
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)	Europe, Southeast Asia/ Mideast, Africa	Europe, Southeast Asia/ Mideast, Africa	Europe, Southeast Asia/ Mideast, Africa
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand	-	OEM, Own Brand	OEM, Own Brand	OEM, Own Brand
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	Off-season: within 15 Day(s) Peak-season: 1 Month(s)	Off-season: within 15 Day(s) Peak-season: 1 Month(s)	Off-season: within 15 Day(s) Peak-season: 1 Month(s)
Product Attributes
Specification	Morphology: Solid-State; Application: Electronic Product; Material: Polyurethane; Classification: Hot Melt; Color: White;	CAS No.: 9003-22-9; Formula: None; EINECS: None; Bonding Function: Pressure sensitive Adhesive; Morphology: Solvent; Material: Polyester; Classification: Pressure-Sensitive; Characteristic: Weatherability; Promoter Composition: Plasticizer; Composition: Organic Material; Color: White;	CAS No.: 7085-85-0; Formula: C6h7n02; EINECS: 210-898-8; Bonding Function: Instant Adhesive; Morphology: Paste; Application: Construction, Decorations; Material: Epoxy; Classification: Room Curing; Main Agent Composition: Inorganic Adhesive Material; Characteristic: Waterproof; Promoter Composition: Curing Agent; Composition: Inorganic Material;	CAS No.: 7085-85-0; Formula: C6h7n02; EINECS: 210-898-8; Bonding Function: Instant Adhesive; Morphology: Paste; Application: Construction, Decorations; Material: Epoxy; Classification: Room Curing; Main Agent Composition: Inorganic Adhesive Material; Characteristic: Waterproof; Promoter Composition: Curing Agent; Composition: Inorganic Material;	CAS No.: 7085-85-0; Formula: C6h7n02; EINECS: 210-898-8; Bonding Function: Instant Adhesive; Morphology: Paste; Application: Construction, Decorations; Material: Epoxy; Classification: Room Curing; Main Agent Composition: Inorganic Adhesive Material; Characteristic: Waterproof; Promoter Composition: Curing Agent; Composition: Inorganic Material;
Supplier Name	Wuxi East Group Trading Co., Ltd.	Wuxi Honghui New Materials Technology Co., Ltd.	YIYANG WONSTAR BUILDING MATERIAL CO., LTD.	YIYANG WONSTAR BUILDING MATERIAL CO., LTD.	YIYANG WONSTAR BUILDING MATERIAL CO., LTD.
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