Specification |
Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / PCB Manufacturing;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Technology: SMD, Tht,Double-Sided SMT Assembly, Fine Pitch to;
SMT Line: 11 SMT Lines;
SMT Capability: 20,000,000 Points Per Day;
DIP Capability: 300,000 Points Per Day;
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Customized: Customized;
Condition: New;
Inductance: 6.5μh;
Certificate Standard: Compatible with Qi Standards;
Work Frequency: 100-205kHz;
Dimension: 76*35mm;
Application: Vehicle Smartphone Holder Power Bank;
Charging Power: 15W Max;
Charging Efficiency: 84% Max;
Charging Distanc: 5-8mm;
Charging Protocol: Has Passed The EPP Qi2.0 Certif;
Protection Functio: Overcurrent, Overvoltage, Shortcircuit, Temperatu;
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Layers: Single-Layer;
Customized: Customized;
Condition: New;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Service: PCB/Components Sourcing/Assembly/Test/Package;
Certificate: So9001, ISO14000, Ts16949.UL.RoHS;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Testing: X-ray, Aoi, Ict, Fct;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
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