High-End Consumer Long-Distance Communication Telecommunication Smart Device Assembly High-Frequency PCB Telecommunications PCBA RF Circuit Integration pictures & photos
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High-End Consumer Long-Distance Communication Telecommunication Smart Device Assembly High-Frequency PCB Telecommunications PCBA RF Circuit Integration pictures & photos
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High-End Consumer Long-Distance Communication Telecommunication Smart Device Assembly High-Frequency PCB Telecommunications PCBA RF Circuit Integration pictures & photos
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High-End Consumer Long-Distance Communication Telecommunication Smart Device Assembly High-Frequency PCB Telecommunications PCBA RF Circuit Integration pictures & photos
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High-End Consumer Long-Distance Communication Telecommunication Smart Device Assembly High-Frequency PCB Telecommunications PCBA RF Circuit Integration pictures & photos
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High-End Consumer Long-Distance Communication Telecommunication Smart Device Assembly High-Frequency PCB Telecommunications PCBA RF Circuit Integration pictures & photos
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  • High-End Consumer Long-Distance Communication Telecommunication Smart Device Assembly High-Frequency PCB Telecommunications PCBA RF Circuit Integration
  • High-End Consumer Long-Distance Communication Telecommunication Smart Device Assembly High-Frequency PCB Telecommunications PCBA RF Circuit Integration
  • High-End Consumer Long-Distance Communication Telecommunication Smart Device Assembly High-Frequency PCB Telecommunications PCBA RF Circuit Integration
  • High-End Consumer Long-Distance Communication Telecommunication Smart Device Assembly High-Frequency PCB Telecommunications PCBA RF Circuit Integration
  • High-End Consumer Long-Distance Communication Telecommunication Smart Device Assembly High-Frequency PCB Telecommunications PCBA RF Circuit Integration
  • High-End Consumer Long-Distance Communication Telecommunication Smart Device Assembly High-Frequency PCB Telecommunications PCBA RF Circuit Integration

High-End Consumer Long-Distance Communication Telecommunication Smart Device Assembly High-Frequency PCB Telecommunications PCBA RF Circuit Integration

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About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01-10.00 / Piece

Sepcifications

  • Metal Coating Enig / HASL / OSP / Silver etc.
  • Mode of Production SMT / DIP / Customized
  • Layers From 2 Layers to 50 Layers
  • Base Material Fr4/ High Tg Fr4/ Metal Core / Cem
  • Certification RoHS, CCC, ISO
  • Customized Customized
  • Condition New
  • Transport Package UPS/DHL/TNT/EMS/FedEx
  • Origin China
  • Quality Standard Ipc Class 2 / Class 3
  • Flame Retardant Properties 94V0
  • Layers Count 6 Layser
  • Mininum Trace Width 2.5 Mil
  • Max Copper Thickness 10 Oz

Product Description

PCB &PCBA Cpabilities PCB Manufacturing Capabilities Layer count 1-50 layers Material FR4,Tg=135,150,170,180,210,AL base,Rogers,Nelco Copper thickness 1/2oz,1oz,2oz,3oz,4oz,5oz-10 oz Board thickness 0.2-10.0mm Min.line width/space 3/3 mil(75/75um) Min. drill size 8 mil(0.2mm) Min. HDI ...

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High-End Consumer Long-Distance Communication Telecommunication Smart Device Assembly High-Frequency PCB Telecommunications PCBA RF Circuit Integration

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Transaction Info
Price US $ 0.01-10.00/ Piece US $ 0.50-2.00/ Piece US $ 0.50-2.00/ Piece US $ 39.00-42.00/ Piece US $ 0.30-1.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 50 Pieces 1 Pieces
Payment Terms L/C, T/T, D/P, Western Union, Paypal L/C, T/T, Western Union L/C, T/T, Western Union L/C, T/T, D/P, Western Union, Paypal, Money Gram, Cash L/C, T/T, Western Union
Quality Control
Product Certification RoHS, CCC, ISO RoHS, ISO RoHS, ISO RoHS, ISO RoHS, ISO
Management System Certification - ISO 9001, ISO 9000, ISO 14001 ISO 9001, ISO 9000, ISO 14001 ISO 9001, BSCI ISO 9001, ISO 9000, ISO 14001
Trade Capacity
Export Markets - South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Oceania, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - US$50 Million - US$100 Million US$50 Million - US$100 Million US$10 Million - US$50 Million US$50 Million - US$100 Million
Business Model - OEM, ODM OEM, ODM OEM, ODM, Own Brand(Volker) OEM, ODM
Average Lead Time - Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays		 Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays		 Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month		 Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / Customized;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Quality Standard: Ipc Class 2 / Class 3;
Flame Retardant Properties: 94V0;
Layers Count: 6 Layser;
Mininum Trace Width: 2.5 Mil;
Max Copper Thickness: 10 Oz;
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Copper Weight: 18um, 25um, 35um, 70um;
Surface Treatment: OSP/HASL/Lf HASL/Enig/Imm Tin etc;
Soldermask Color: White, Black, Green, Blue etc.;
Finished Thickness: 0.8~1.6mm;
Waveform: Pure Sine Wave;
Input Voltage: 12V/24V/36V/48V;
Output Voltage: 110V/220V;
Frequency: 50Hz/60Hz;
Keyword: PCB Circuit Board;
Communication: R485/R232/Can;
LCD Display: Optional;
Dimension: Customizable;
Power: 300W-6000W;
Charging Current: Customizable;
Remote Control: Customizable;
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
Supplier Name

Shenzhen Core Hecheng Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

Gold Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

Gold Member Audited Supplier

Hubei Volker New Energy Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

Gold Member Audited Supplier

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