Multilayer HASL Enig Copper Base Custom-Made Automation Systems Multimedia Rigid PCB PCBA

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01 / Piece

Sepcifications

  • Metal Coating Enig / HASL / OSP / Silver etc.
  • Mode of Production SMT / DIP / PCB Manufacturing
  • Layers From 2 Layers to 50 Layers
  • Base Material Fr4/ High Tg Fr4/ Metal Core / Cem
  • Certification RoHS, CCC, ISO
  • Customized Customized
  • Condition New
  • Transport Package UPS/DHL/TNT/EMS/FedEx
  • Specification Custom
  • Trademark OEM
  • Origin China
  • Technology SMD, Tht,Double-Sided SMT Assembly, Fine Pitch to
  • SMT Line 11 SMT Lines
  • SMT Capability 20,000,000 Points Per Day
  • DIP Capability 300,000 Points Per Day

Product Description

Product Description PCB Capability Layer count 1-50 layers Material FR4,Tg=135,150,170,180,210,AL base,Rogers,Nelco,CEM,Flex,and etc Copper thickness 1/2oz,1oz,2oz,3oz,4oz,5oz-10 oz Board thickness 0.2-10.0mm Min.line width/space 3/3 mil(75/75um) Min. drill size 8 mil(0.2mm) Min. HDI ...

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Custom-Made PCB PCBA Comparison
Transaction Info
Price US $ 0.01/ Piece US $ 1.00-28.00/ Piece US $ 1.00-20.00/ Piece US $ 1.00-20.00/ Piece US $ 0.30-0.45/ PCS
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 PCS
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal, Money Gram L/C, T/T, Paypal
Quality Control
Product Certification RoHS, CCC, ISO RoHS, UL RoHS, UL RoHS, CCC, ISO RoHS, ISO, UL
Management System Certification - ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025 ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025 ISO 9001, IATF16949, QC 080000 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949
Trade Capacity
Export Markets - North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue - US$50 Million - US$100 Million US$50 Million - US$100 Million US$10 Million - US$50 Million Above US$100 Million
Business Model - OEM, ODM OEM, ODM OEM, ODM OEM
Average Lead Time - Off Season Lead Time: one month
Peak Season Lead Time: one month
Off Season Lead Time: one month
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / PCB Manufacturing;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Technology: SMD, Tht,Double-Sided SMT Assembly, Fine Pitch to;
SMT Line: 11 SMT Lines;
SMT Capability: 20,000,000 Points Per Day;
DIP Capability: 300,000 Points Per Day;
Metal Coating: Copper/ Tin/ Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Basic Material: Fr-4;
PCBA Testing: X-ray, Aoi Test, Function Test;
PCBA Min. BGA Pitch: 0.2mm;
Certificate: RoHS, UL / ISO9001, ISO13485, IATF16949;
Processing Technology: Electrolytic Foil;
Other Service: SMT, DIP;
Insulation Materials: Organic Resin;
Application: Consumer Electronics, Communications, Aerospace;
PCB Surface Treatment: HASL Lead Free, OPS, Immersion Tin/Gold, etc;
Metal Coating: Copper/ Tin/ Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Basic Material: Fr-4;
PCBA Testing: X-ray, Aoi Test, Function Test;
PCBA Min. BGA Pitch: 0.2mm;
Certificate: RoHS, UL / ISO9001, ISO13485, IATF16949;
Processing Technology: Electrolytic Foil;
Other Service: SMT, DIP;
Insulation Materials: Organic Resin;
Application: Consumer Electronics, Communications, Aerospace;
PCB Surface Treatment: HASL Lead Free, OPS, Immersion Tin/Gold, etc;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
PCBA-Testing: X-ray,Aoi;
Type: Rigid Circuit Board;
Small Order: Acceptable;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Layer: 10L;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Supplier Name

Shenzhen Core Hecheng Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Zhendatech Co., Ltd.

Gold Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier