Specification |
Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / PCB Manufacturing;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Technology: SMD, Tht,Double-Sided SMT Assembly, Fine Pitch to;
SMT Line: 11 SMT Lines;
SMT Capability: 20,000,000 Points Per Day;
DIP Capability: 300,000 Points Per Day;
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Metal Coating: Copper/ Tin/ Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Basic Material: Fr-4;
PCBA Testing: X-ray, Aoi Test, Function Test;
PCBA Min. BGA Pitch: 0.2mm;
Certificate: RoHS, UL / ISO9001, ISO13485, IATF16949;
Processing Technology: Electrolytic Foil;
Other Service: SMT, DIP;
Insulation Materials: Organic Resin;
Application: Consumer Electronics, Communications, Aerospace;
PCB Surface Treatment: HASL Lead Free, OPS, Immersion Tin/Gold, etc;
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Metal Coating: Copper/ Tin/ Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Basic Material: Fr-4;
PCBA Testing: X-ray, Aoi Test, Function Test;
PCBA Min. BGA Pitch: 0.2mm;
Certificate: RoHS, UL / ISO9001, ISO13485, IATF16949;
Processing Technology: Electrolytic Foil;
Other Service: SMT, DIP;
Insulation Materials: Organic Resin;
Application: Consumer Electronics, Communications, Aerospace;
PCB Surface Treatment: HASL Lead Free, OPS, Immersion Tin/Gold, etc;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
PCBA-Testing: X-ray,Aoi;
Type: Rigid Circuit Board;
Small Order: Acceptable;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Layer: 10L;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
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