Specification |
Metal Coating: Enig / HASL / OSP / Silver etc;
Mode of Production: SMT / DIP / PCB Manufacturing;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Solder Mask Color: Green,Blue,Yellow,White,Black,Red;
Special Process: Buried Hole, Blind Hole, Partial High Density, Bac;
Copper Thickness: 1/2oz,1oz,2oz,3oz,4oz,5oz-10 Oz;
Layer Count: 1-50 Layers;
Quality Standard: Ipc Class 2 and Ipc Class 3;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Operation System: Linux;
Memory: 25n01gvze1g;
USB: Type-C;
Serial Port: I2c :1 Uart :3;
USB Interface: 1;
CTP Interface: 1;
Rgbrgb Interface": 1;
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Metal Coating: Copper/Tin/Gold/Silver/HASL/OSP/Enig;
Mode of Production: SMT and DIP;
Layers: Multilayer;
Base Material: Fr-4/ High Tg Fr-4/ Aluminum/ Ceramic/ Copper/ Hal;
Customized: Customized;
Condition: New;
Service: PCB+Assembly+Components;
Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
Testing Service: Electrical Testing, Flying Probe Tester, Functional;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.075---0.09mm;
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Metal Coating: Copper/Tin/Gold/Silver/HASL/OSP/Enig;
Mode of Production: SMT and DIP;
Layers: Multilayer;
Base Material: Fr-4/ High Tg Fr-4/ Aluminum/ Ceramic/ Copper/ Hal;
Customized: Customized;
Condition: New;
Service: PCB+Assembly+Components;
Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
Testing Service: Electrical Testing, Flying Probe Tester, Functional;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.075---0.09mm;
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Layers: Multilayer;
Customized: Customized;
Condition: New;
Service: PCB+Assembly+Components;
Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
Testing Service: Electrical Testing,Flying Probe Tester,Functional;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.075---0.09mm;
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