Customized PCB Board Multilayer One-Stop Service Manufacturer Printed Circuit Board Assembly PCBA in China Video

Name: Customized PCB Board Multilayer One-Stop Service Manufacturer Printed Circuit Board Assembly PCBA in China
Uploaded: 2025-01-21T11:42:28+08:00
Description: Product Description PCB Capability Layer count 1-50 layers Material FR4,Tg=135,150,170,180,210,AL base,Rogers,Nelco,CEM,Flex,and etc Copper thickness 1/2oz,1oz,2oz,3oz,4oz,5oz-10 oz Board thickness

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Price

Min. Order Reference FOB Price

1 Piece US$0.01 / Piece

Sepcifications

Metal Coating Enig / HASL / OSP / Silver etc.
Mode of Production SMT / DIP / PCB Manufacturing
Layers From 2 Layers to 50 Layers
Base Material Fr4/ High Tg Fr4/ Metal Core / Cem
Certification RoHS, CCC, ISO
Customized Customized
Condition New
Transport Package UPS/DHL/TNT/EMS/FedEx
Specification Custom
Trademark OEM
Origin China
Technology SMD, Tht,Double-Sided SMT Assembly, Fine Pitch to
SMT Line 11 SMT Lines
SMT Capability 20,000,000 Points Per Day
DIP Capability 300,000 Points Per Day

Product Description

Product Description PCB Capability Layer count 1-50 layers Material FR4,Tg=135,150,170,180,210,AL base,Rogers,Nelco,CEM,Flex,and etc Copper thickness 1/2oz,1oz,2oz,3oz,4oz,5oz-10 oz Board thickness 0.2-10.0mm Min.line width/space 3/3 mil(75/75um) Min. drill size 8 mil(0.2mm) Min. ...

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Customized PCB Board Comparison

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Transaction Info
	Customized PCB Board Multilayer One-Stop Service Manufacturer Printed Circuit Board Assembly PCBA in China Contact Now	Quick View New and Original Raspberry Pi 4b 4G Development Board Single Board Computer Contact Now	Quick View Equipment Head Control Circuit Board PCBA Professional Manufature Contact Now	Quick View Double-Sided Circuit Board Professional Customized PCB&PCBA Manufacturer Contact Now	Quick View Raspberry Pi Cm4 Compute Module 4 Main Board Cm4002032 2g+32g Contact Now
Price	US $ 0.01/ Piece	Negotiable	US $ 1.00-100.00/ Piece	US $ 1.00-100.00/ Piece	Negotiable
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal, Money Gram	L/C, T/T, Western Union, Paypal, Money Gram	L/C, T/T, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal, Money Gram
Quality Control
Product Certification	RoHS, CCC, ISO	RoHS, CCC	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC
Management System Certification	-	ISO 9001	ISO 9001, IATF16949, QC 080000	ISO 9001, IATF16949, QC 080000	ISO 9001
Trade Capacity
Export Markets	-	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	US$10 Million - US$50 Million	US$10 Million - US$50 Million	-
Business Model	-	-	OEM, ODM	OEM, ODM	-
Average Lead Time	-	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Metal Coating: Enig / HASL / OSP / Silver etc.; Mode of Production: SMT / DIP / PCB Manufacturing; Layers: From 2 Layers to 50 Layers; Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem; Customized: Customized; Condition: New; Technology: SMD, Tht,Double-Sided SMT Assembly, Fine Pitch to; SMT Line: 11 SMT Lines; SMT Capability: 20,000,000 Points Per Day; DIP Capability: 300,000 Points Per Day;	Metal Coating: Tin; Mode of Production: SMT; Layers: Single-Layer; Customized: Non-Customized; Condition: New; Processor: Broadcom Bcm2711; Memory: 4GB; Connectivity: 2.4 GHz and 5.0 GHz IEEE 802.11b/G/N/AC Wireless L; Coo: UK;	Metal Coating: Copper; Mode of Production: SMT; Layers: Multilayer; Base Material: FR-4; Customized: Customized; Condition: Used; Functional Testing: Spi, X-ray, Aoi, Ict, Fct, RoHS and Aging; Type: Rigid Circuit Board; PCBA Min. IC Pitch: 0.30mm(12mil); Processing Technology: Electrolytic Foil; Insulation Materials: Organic Resin; BGA Minimum Dia: 01015; PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA; Small Order: Acceptable; IP Protection: Strong Believe in IP Protection with Proven Record;	Metal Coating: Copper; Mode of Production: SMT; Layers: Multilayer; Base Material: FR-4; Customized: Customized; Condition: Used; Functional Testing: Spi, X-ray, Aoi, Ict, Fct, RoHS and Aging; Type: Rigid Circuit Board; PCBA Min. IC Pitch: 0.30mm(12mil); Processing Technology: Electrolytic Foil; Insulation Materials: Organic Resin; BGA Minimum Dia: 01015; PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA; Small Order: Acceptable; IP Protection: Strong Believe in IP Protection with Proven Record;	Metal Coating: Tin; Mode of Production: SMT; Layers: Single-Layer; Base Material: PCB; Customized: Non-Customized; Condition: New; Form Factor: 55mm 40mm;* Processor: Broadcom Bcm2711; Input Power: DC 5V; Operating Temperature: 0 ~ 80ºC;
Supplier Name	Shenzhen Core Hecheng Electronic Technology Co., Ltd.	CENTURY SOLUTIONS LIMITED	Shenzhen Zhendatech Co., Ltd.	Shenzhen Zhendatech Co., Ltd.	CENTURY SOLUTIONS LIMITED
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