Multilayer PCB Board for Automobile Telephone/Power Bank Printed Circuit Board pictures & photos

Multilayer PCB Board for Automobile Telephone/Power Bank Printed Circuit Board

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Price

Min. Order Reference FOB Price

1 Piece US$0.10 / Piece

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Polyester Glass Fiber Mat Laminate
Application Industrial Products
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Additive Process
Base Material Fr4
Insulation Materials Organic Resin
Transport Package Vacuum Package
Specification Normal
Trademark OEM
Origin China
Silkscreen White, Black, Red
Solder Mask Green, Yellow, Red, White, Black, Blue
Surface Finishing HASL, Lf-Hal, Immerion Tin, Immerion Gold, OSP
Board Thickness 1.6mm
Copper Thickness 35um
Min Line Spacing 0.2mm
Min Line Width 0.2mm
Min Hole Size 0.25mm
Certificate UL, RoHS, SGS, Ect
Package Vacuum

Product Description

WELCOME TO XJYPCB------------------ Shenzhen Xinjiaye Electronics Technology Co., Ltd is a professional pcb manufacturer has over 10 years experience. We are able to offer 1 to 24 Layer PCB, ranging from pcb produce, components purchase, pcb assembly, pcb copy service.Our products are widely used ...

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Shenzhen Xinjiaye Electronics Technology Co., Ltd.

Gold Member Since 2013

Audited Supplier

Business Type Manufacturer/Factory, Trading Company
Main Products PCB, PCB Board, Aluminum PCB, FPC, PCBA, LED PCB, PCB Assembly, Printed Circuit Board, Rigid PCB, MCPCB
Terms of Payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Printed Circuit Board Comparison

	Multilayer PCB Board for Automobile Telephone/Power Bank Printed Circuit Board Contact Now	Quick View HDI High Density Interconnect Industrial Visualizer PCB 10layer Em825 Enig 3mil Contact Now	Quick View Ipc Industrial Computer HDI 4layer HASL-Lf Material Gw1500 PCB Contact Now	Quick View Industrial PC High Density Interconnect 18layer PCB 2.4mm OSP Contact Now	Quick View Automotive Fleet Management System HDI PCB 4layer Enig Em825 Contact Now

Transaction Info
	Multilayer PCB Board for Automobile Telephone/Power Bank Printed Circuit Board Contact Now	Quick View HDI High Density Interconnect Industrial Visualizer PCB 10layer Em825 Enig 3mil Contact Now	Quick View Ipc Industrial Computer HDI 4layer HASL-Lf Material Gw1500 PCB Contact Now	Quick View Industrial PC High Density Interconnect 18layer PCB 2.4mm OSP Contact Now	Quick View Automotive Fleet Management System HDI PCB 4layer Enig Em825 Contact Now
Price	US $ 0.1/ Piece	US $ 3.26-24.80/ Piece	US $ 1.05-7.96/ Piece	US $ 3.69-32.80/ Piece	US $ 0.967-8.58/ Piece
Min Order	1 Pieces	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram, cash	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Product Certification	UL, RoHS, SGS, Ect	-	-	-	-
Management System Certification	ISO 9001, ISO 14001	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Industrial Products; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Fr4; Insulation Materials: Organic Resin; Silkscreen: White, Black, Red; Solder Mask: Green, Yellow, Red, White, Black, Blue; Surface Finishing: HASL, Lf-Hal, Immerion Tin, Immerion Gold, OSP; Board Thickness: 1.6mm; Copper Thickness: 35um; Min Line Spacing: 0.2mm; Min Line Width: 0.2mm; Min Hole Size: 0.25mm; Package: Vacuum;	Structure: HDI PCB; Dielectric: Fr4 Em825; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 10layer - 18layer; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Blind/Buried Vias: 0.1mm Laser Drilling;	Structure: HDI PCB; Dielectric: Fr4 Gw1500; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 4layer - 18layer; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Blind/Buried Vias: 0.1mm Laser Drilling;	Structure: HDI PCB; Dielectric: Fr4 Tg170 2.0/2.4mm; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig, OSP; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 12layer - 18layer; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Blind/Buried Vias: 0.1mm Laser Drilling; Unit Size: 609.6mm X 457.2mm;	Structure: HDI PCB; Dielectric: Fr4 Em825 1.0mm; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 4layer - 18layer; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Blind/Buried Vias: 0.1mm Laser Drilling;
Supplier Name	Shenzhen Xinjiaye Electronics Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.
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