Printed Circuit Board
US$0.10 / Piece
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What is Custom LCD Display PCB Board Manufacture

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10 / Piece

Sepcifications

  • Structure Metal Base Rigid PCB
  • Dielectric Al
  • Material Polyester Glass Fiber Mat Laminate
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Subtractive Process
  • Base Material Aluminum
  • Insulation Materials Epoxy Resin
  • Transport Package Vacuum Package
  • Specification Normal
  • Trademark XJYPCB
  • Origin China
  • Surface Finishing Lf-Hal
  • Copper Thickness 1oz
  • Board Thickness 1.6mm
  • Min. Hole Size 0.25mm
  • Min. Line Wigth 0.15mm
  • Min. Line Spacing 0.15mm
  • Color Green
  • Size 35*45mm
  • Certificate RoHS, UL, SGS, Ect
  • Package Vacuum

Product Description

WELCOME TO XJY------------ Shenzhen Xinjiaye Electronics Technology Co., Ltd is a professional pcb manufacturer has over 10 years experience. We are able to offer 1 to 24 Layer PCB, ranging from pcb produce, components purchase, pcb assembly, pcb copy service.Our products are widely used in ...

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Printed Circuit Board Comparison
Transaction Info
Price US $ 0.1/ Piece US $ 0.48-3.20/ Piece US $ 0.715-5.40/ Piece US $ 2.40-8.80/ Piece US $ 0.99-3.95/ Piece
Min Order 1 Pieces 100 Pieces 100 Pieces 100 Pieces 100 Pieces
Trade Terms FOB, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA, EXW - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Product Certification RoHS, UL, SGS, Ect - - - -
Management System Certification ISO 9001, ISO 14001 ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Metal Base Rigid PCB;
Dielectric: Al;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Surface Finishing: Lf-Hal;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.25mm;
Min. Line Wigth: 0.15mm;
Min. Line Spacing: 0.15mm;
Color: Green;
Size: 35*45mm;
Package: Vacuum;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: up to 64;
Cu Thickness: up to 12oz;
Board Thickness: up to 8mm;
Inner Min. Hole to Line: 8.5mil;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: up to 64;
Cu Thickness: up to 12oz;
Board Thickness: up to 8mm;
Min. Hole to Line: 7.8mil;
Surface Finish: Plated Gold 40u;
Min. Trace Line&Space: 3/3mil;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: up to 64;
Cu Thickness: up to 12oz;
Board Thickness: up to 8mm;
Min. Hole to Line: 9mil;
Surface Finish: Plated Gold 30u;
Min. Trace Line&Space: 3/3mil;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: up to 64;
Cu Thickness: up to 12oz;
Board Thickness: up to 8mm;
Inner Core Material: 0.1mm;
Surface Finish: Immersiong Gold;
Min. Hole to Line: 3/3mil;
Supplier Name

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier