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Electronic Lock PCB Circuit Board

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.15 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Paper Phenolic Copper Foil Substrate
Application Electronic Lock
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Fr4
Insulation Materials Organic Resin
Transport Package Vacuum Package
Specification Normal
Trademark XJY/ OEM
Origin China
Copper Thickness 2oz
Board Thickness 1.6mm
Min. Hole Size 0.25mm
Min. Line Space 0.075mm
Min. Line Width 0.075mm
Solder Mask Green
Test Aoi
Package Vacuum Package
Certificate UL, SGS, RoHS, Ect
Shipping UPS, DHL, FedEx, Ect

Product Description

WELCOME TO XJY-------------- Shenzhen Xinjiaye Electronics Technology Co., Ltd is a professional pcb manufacturer has over 10 years experience. We are able to offer 1 to 24 Layer PCB, ranging from pcb produce, components purchase, pcb assembly, pcb copy service.Our products are widely used ...

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Shenzhen Xinjiaye Electronics Technology Co., Ltd.

Gold Member Since 2013

Audited Supplier

Business Type Manufacturer/Factory, Trading Company
Main Products PCB, PCB Board, Aluminum PCB, FPC, PCBA, LED PCB, PCB Assembly, Printed Circuit Board, Rigid PCB, MCPCB
Terms of Payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Circuit Board Comparison

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Transaction Info
	Electronic Lock PCB Circuit Board Contact Now	Quick View SMT DIP Services Printed Circuit Board Assembly for Automobile Contact Now	Quick View Printed Circuit Board SMT Electronics PCB Assembly Contact Now	Quick View Customized PCBA Assembly and PCB Manufacturer Services Contact Now	Quick View One-Stop Printed Circuit Board OEM/ODM PCB Assembly PCBA Contact Now
Price	US $ 0.15/ Piece	US $ 0.32-5.00/ Piece	US $ 0.32-7.00/ Piece	US $ 0.32-6.00/ Piece	US $ 0.32-6.00/ Piece
Min Order	1 Pieces	10 Pieces	10 Pieces	10 Pieces	10 Pieces
Trade Terms	FOB, CFR, EXW, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, D/P, Paypal, Money Gram	T/T, D/P, Paypal, Money Gram	T/T, D/P, Paypal, Money Gram	T/T, D/P, Paypal, Money Gram
Quality Control
Product Certification	UL, SGS, RoHS, Ect	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO
Management System Certification	ISO 9001, ISO 14001	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	Domestic	Domestic	Domestic	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Paper Phenolic Copper Foil Substrate; Application: Electronic Lock; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4; Insulation Materials: Organic Resin; Copper Thickness: 2oz; Board Thickness: 1.6mm; Min. Hole Size: 0.25mm; Min. Line Space: 0.075mm; Min. Line Width: 0.075mm; Solder Mask: Green; Test: Aoi; Package: Vacuum Package; Shipping: UPS, DHL, FedEx, Ect;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;
Supplier Name	Shenzhen Xinjiaye Electronics Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.
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