Specification |
Structure: Metal Base Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Surface Finishing: Lf-Hal;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.25mm;
Min. Line Wigth: 0.15mm;
Min. Line Spacing: 0.15mm;
Color: Green;
Size: 35*45mm;
Package: Vacuum;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4, Fr-4;
Material: Polyester Glass Fiber Mat Laminate, Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics, Consumer Electronics;
Flame Retardant Properties: V1, V0;
Processing Technology: Electrolytic Foil, Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper, Copper;
Insulation Materials: Epoxy Resin, Epoxy Resin;
Brand: Szx, Szx;
Type: Rigid Circuit Board;
Mechanical Rigid: Rigid;
Layers: Multilayer;
Solder Marsk: Green, Black, Blue, Red, Yellow, White;
Hole: Mechanical Hole, Laser Hole;
Assembly: Components;
Processing: SMT and DIP;
Surface Treatment: HASL, Immersion Gold, OSP;
Service Providing: PCB Production, PCB Assembly, Components Sourcing;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4, Fr-4;
Material: Polyester Glass Fiber Mat Laminate, Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics, Consumer Electronics;
Flame Retardant Properties: V1, V0;
Processing Technology: Electrolytic Foil, Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper, Copper;
Insulation Materials: Epoxy Resin, Epoxy Resin;
Brand: Szx, Szx;
Type: Rigid Circuit Board;
Mechanical Rigid: Rigid;
Layers: Multilayer;
Solder Marsk: Green, Black, Blue, Red, Yellow, White;
Hole: Mechanical Hole, Laser Hole;
Assembly: Components;
Processing: SMT and DIP;
Surface Treatment: HASL, Immersion Gold, OSP;
Service Providing: PCB Production, PCB Assembly, Components Sourcing;
|
Structure: Multilayer Rigid PCB;
Dielectric: FR-4, Fr-4;
Material: Polyester Glass Fiber Mat Laminate, Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics, Consumer Electronics;
Flame Retardant Properties: V1, V0;
Processing Technology: Electrolytic Foil, Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper, Copper;
Insulation Materials: Epoxy Resin, Epoxy Resin;
Brand: Szx, Szx;
Type: Rigid Circuit Board;
Mechanical Rigid: Rigid;
Layers: Multilayer;
Solder Marsk: Green, Black, Blue, Red, Yellow, White;
Hole: Mechanical Hole, Laser Hole;
Assembly: Components;
Processing: SMT and DIP;
Surface Treatment: HASL, Immersion Gold, OSP;
Service Providing: PCB Production, PCB Assembly, Components Sourcing;
|
Structure: Multilayer Rigid PCB;
Dielectric: FR-4, Fr-4;
Material: Polyester Glass Fiber Mat Laminate, Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics, Consumer Electronics;
Flame Retardant Properties: V1, V0;
Processing Technology: Electrolytic Foil, Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper, Copper;
Insulation Materials: Epoxy Resin, Epoxy Resin;
Brand: Szx, Szx;
Type: Rigid Circuit Board;
Mechanical Rigid: Rigid;
Layers: Multilayer;
Solder Marsk: Green, Black, Blue, Red, Yellow, White;
Hole: Mechanical Hole, Laser Hole;
Assembly: Components;
Processing: SMT and DIP;
Surface Treatment: HASL, Immersion Gold, OSP;
Service Providing: PCB Production, PCB Assembly, Components Sourcing;
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