Electronical Control Panel PCB Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Square Meter Negotiable

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Polyester Glass Fiber Mat Laminate
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Subtractive Process
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Transport Package Vacuum Package
  • Specification ROHS, UL ISO 14000
  • Trademark XJYPCB
  • Origin Shenzhen
  • Copper Thickness 1oz
  • Green Solder Mask Green
  • Surface Finish HASL-Lead Free
  • Board Thickness 1mm
  • Min Hole Size 0.6mm
  • Min Line Width 4mil
  • Min Line Spacing 4mil
  • Surface Finishing Hal, Immersion Gold, Ect
  • Certificate UL, SGS, RoHS, ISO 9001, Ect
  • Package Vacuum

Product Description

WELCOME TO XJY-------------- Shenzhen Xinjiaye Electronics Technology Co., Ltd is a professional pcb manufacturer has over 10 years experience. We are able to offer 1 to 24 Layer PCB, ranging from pcb produce, components purchase, pcb assembly, pcb copy service.Our products are widely used ...

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Printed Circuit Board Comparison
Transaction Info
Price Negotiable US $ 1.74-19.30/ Piece US $ 1.75-19.40/ Piece US $ 0.67-12.53/ Piece US $ 2.15-18.90/ Piece
Min Order 1 Square Meters 100 Pieces 100 Pieces 100 Pieces 100 Pieces
Trade Terms FOB, CFR, EXW, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Product Certification UL, SGS, RoHS, ISO 9001, Ect - - - -
Management System Certification ISO 9001, ISO 14001 ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Copper Thickness: 1oz;
Green Solder Mask: Green;
Surface Finish: HASL-Lead Free;
Board Thickness: 1mm;
Min Hole Size: 0.6mm;
Min Line Width: 4mil;
Min Line Spacing: 4mil;
Surface Finishing: Hal, Immersion Gold, Ect;
Package: Vacuum;
Structure: HDI PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Blind&Buried Vias;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: 6layer - 12layer;
HDI Structure: 1+N+1 to Any Layer;
Min. Trace/Space: 2/2mil;
Special Material: Em825, S1000h;
Blind/Buried Vias: 0.1mm Laser Drilling;
Structure: HDI PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Blind&Buried Vias;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: 6layer - 12layer;
HDI Structure: 1+N+1 to Any Layer;
Min. Trace/Space: 2/2mil;
Special Material: Em825, S1000h;
Blind/Buried Vias: 0.1mm Laser Drilling;
Structure: HDI PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Blind&Buried Vias;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: 6layer - 12layer;
HDI Structure: 1+N+1 to Any Layer;
Min. Trace/Space: 2/2mil;
Special Material: Em825, S1000h;
Blind/Buried Vias: 0.1mm Laser Drilling;
Structure: HDI PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Blind&Buried Vias;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: 6layer - 12layer;
HDI Structure: 1+N+1 to Any Layer;
Min. Trace/Space: 2/2mil;
Special Material: Em825, S1000h;
Blind/Buried Vias: 0.1mm Laser Drilling;
Supplier Name

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier