Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Xmd;
Criteria: Aql II 0.65;
Hole Sizes: 0.15mm/0.2mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Enig;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Organic Resin;
The Capacity of Production: 50, 000sqm. /Month;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 5-7days;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
The Capacity of Production: 50, 000sqm. /Month;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 5-7days;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Flame Retardant Properties: V0;
Insulation Materials: Organic Resin;
The Capacity of Production: 50, 00sqm. /Month;
PP Thickness: 7628(0.18mm) 2116(0.12mm) 1080(0.08mm);
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 5-7days;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Flame Retardant Properties: V0;
The Capacity of Production: 50, 000sqm. /Month;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 5-7days;
|