What is Double Multilayer PCB Integrated Boards Panels Plating

Name: Double Multilayer PCB Integrated Boards Panels Plating
Uploaded: 2024-04-23T14:49:22+08:00
Description: Specifications: Layers:2 Thickness: 1.6mm Material: Aluminum Size: 58*58mm Surface treatment:HASL Line width/spacing: 6/6mil Minimum aperture: 0.3mm Solder mask color: white Finished copper thickness:

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Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$1.00

1,000+ Pieces US$0.95

Sepcifications

Structure Metal Base Rigid PCB
Dielectric Rcc
Material Aluminum
Application LED
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand Shengyi, Kb, Nanya, Ilm
Transport Package Vacuum Packaging
Specification 110*62mm
Trademark XMANDA
Origin Made in China
Criteria Aql II 0.65
Hole Sizes 0.15mm/0.2mm
Bevel Edge Yes
Impedance 50/90/100 Ohm
Trace Width(Min.) 4mil
Surfaec Treatment HASL

Product Description

Specifications: Layers:2 Thickness: 1.6mm Material: Aluminum Size: 58*58mm Surface treatment:HASL Line width/spacing: 6/6mil Minimum aperture: 0.3mm Solder mask color: white Finished copper thickness: inner layer 1 OZ, outer layer 1 OZ Features: 1. The integration of the board ...

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Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

Diamond Member Since 2023

Audited Supplier

Business Range Consumer Electronics, Electrical & Electronics, Instruments & Meters
Main Products PCB, Double-Sided PCB, Multilayer PCB, Printed Circuit Board, Aluminum PCB, PCB Assembly, PCBA, Flexible PCB, Electronic Component, PCB Circuit
OEM/ODM Availability Yes

Printed Circuit Board for LED Application Comparison

	Quick View Double Multilayer PCB Integrated Boards Panels Plating Contact Now	Quick View Fr-4 King Field/OEM Vacuum Packaging Copper Sheet Rigid PCB Circuit Boards Contact Now	Quick View Copper Electrolytic Foil King Field/OEM Vacuum Packaging Al Base Ccl PCB Board Contact Now	Quick View Epoxide Woven Glass Fabric Laminate Aluminium PCB Board Rigid Circuit Boards Contact Now	Quick View Vacuum Packaging Fr-4 King Field/OEM Fr 4 Copper Sheet PCB Circuit Board Contact Now

Transaction Info
	Quick View Double Multilayer PCB Integrated Boards Panels Plating Contact Now	Quick View Fr-4 King Field/OEM Vacuum Packaging Copper Sheet Rigid PCB Circuit Boards Contact Now	Quick View Copper Electrolytic Foil King Field/OEM Vacuum Packaging Al Base Ccl PCB Board Contact Now	Quick View Epoxide Woven Glass Fabric Laminate Aluminium PCB Board Rigid Circuit Boards Contact Now	Quick View Vacuum Packaging Fr-4 King Field/OEM Fr 4 Copper Sheet PCB Circuit Board Contact Now
Price	US $ 0.95-1.00/ Piece	US $ 0.95-2.10/ Piece	US $ 0.95-2.10/ Piece	US $ 0.95-2.10/ Piece	US $ 0.95-2.10/ Piece
Min Order	10 Pieces	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal
Quality Control
Product Certification	-	ISO9001, ISO16949, RoHS	ISO9001, ISO16949, RoHS	ISO9001, ISO16949, RoHS	ISO9001, ISO16949, RoHS
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	-	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Metal Base Rigid PCB; Dielectric: Rcc; Material: Aluminum; Application: LED; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Criteria: Aql II 0.65; Hole Sizes: 0.15mm/0.2mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 4mil; Surfaec Treatment: HASL;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;
Supplier Name	Shenzhen Xinmanda Printed Circuit Board Co., Ltd.	King Field Electronic Co., Ltd. (Shenzhen)	King Field Electronic Co., Ltd. (Shenzhen)	King Field Electronic Co., Ltd. (Shenzhen)	King Field Electronic Co., Ltd. (Shenzhen)
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