| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.15mm/0.2mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Immersion Gold;
|
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM/ODM PCB Assembly;
MOQ: 1 PCS;
Layer: 1-18 Layers;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-4mm;
Min.Line Spacing: 0.1mm (4 Mil);
Copper Thickness: 0.5 Oz-3oz (18 Um-385 Um);
Specialised: LED, Medical, Industrial, Control Board;
Service: PCB/PCBA/Circuit Board/SMT/DIP;
Other Service: PCBA Layout and Design, Engineering Support;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
Products Name: AC/DC Power Supply UPS Battery PCB 94V0;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4 Shengyi Material;
Insulation Materials: Epoxy Resin;
Layer Count: 28layer Backplane;
Surface Finish: Immersion Gold;
Hole Wall Cu: Min. 25um;
Standard: Ipc II;
Certificates: RoHS CCC ISO;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4 Shengyi Material;
Insulation Materials: Epoxy Resin;
Layer Count: 16layer Through Hole Board;
Surface Finish: Immersion Gold;
Hole Wall Cu: Min. 25um;
Standard: Ipc II;
Certificates: RoHS CCC ISO;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4 Shengyi Material;
Insulation Materials: Epoxy Resin;
Layer Count: 4-12layer Through Hole Board;
Surface Finish: Immersion Gold;
Hole Wall Cu: Min. 20um;
Standard: Ipc II;
Certificates: RoHS CCC ISO;
|
