What is Advanced Multilayer Printed Circuit Board

Name: Advanced Multilayer Printed Circuit Board
Uploaded: 2024-05-27T18:18:33+08:00
Description: Specifications: Layers: 4 Thickness:1.6mm Material: FR4 KB6165 Size: 60*80mm Surface treatment: Immersion gold Line width/spacing: 4/4mil Minimum aperture: 0.25mm Solder mask color: Blue Finished copp

Contact Now

Get Latest Price

About this Item

Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$1.00

1,000+ Pieces US$0.95

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand Shengyi, Kb, Nanya, Ilm
Transport Package Vacuum Packaging
Specification 60*80mm
Trademark XMANDA
Origin Made in China
Criteria Aql II 0.65
Hole Sizes 0.15mm/0.2mm
Bevel Edge Yes
Impedance 50/90/100 Ohm
Trace Width(Min.) 3mil
Surfaec Treatment Immersion Gold

Product Description

Specifications: Layers: 4 Thickness:1.6mm Material: FR4 KB6165 Size: 60*80mm Surface treatment: Immersion gold Line width/spacing: 4/4mil Minimum aperture: 0.25mm Solder mask color: Blue Finished copper thickness: inner layer 1 OZ, outer layer 1 OZ Features: 1. The integration ...

Learn More

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

Diamond Member Since 2023

Audited Supplier

Business Range Consumer Electronics, Electrical & Electronics, Instruments & Meters
Main Products PCB, Double-Sided PCB, Multilayer PCB, Printed Circuit Board, Aluminum PCB, PCB Assembly, PCBA, Flexible PCB, Electronic Component, PCB Circuit
OEM/ODM Availability Yes

Microwave PCB Assembly Comparison

	Quick View Advanced Multilayer Printed Circuit Board Contact Now	8-Layer 4-Wire Visual Camera PCBA Contact Now	Quick View New Design Keyboard PCB Hot Swap Audio PCBA Supplier Contact Now	Quick View Stm32f072rbt6 Intergrated Circuit IC Chip Contact Now	Quick View Shenzhen OEM Electronic PCB&PCBA Reverse Engineering PCBA for Industrial Control PCBA Contact Now

Transaction Info
	Quick View Advanced Multilayer Printed Circuit Board Contact Now	8-Layer 4-Wire Visual Camera PCBA Contact Now	Quick View New Design Keyboard PCB Hot Swap Audio PCBA Supplier Contact Now	Quick View Stm32f072rbt6 Intergrated Circuit IC Chip Contact Now	Quick View Shenzhen OEM Electronic PCB&PCBA Reverse Engineering PCBA for Industrial Control PCBA Contact Now
Price	US $ 0.95-1.00/ Piece	US $ 8/ Piece	US $ 0.40-10.00/ Piece	US $ 0.20-0.45/ Piece	US $ 0.40-10.00/ Piece
Min Order	10 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, D/P, Western Union, Paypal	T/T, D/P, Western Union, Paypal	T/T, D/P, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, IATF16949	ISO 9001, IATF16949	ISO 9001, IATF16949	ISO 9001, IATF16949
Trade Capacity
Export Markets	-	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	-	-
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Criteria: Aql II 0.65; Hole Sizes: 0.15mm/0.2mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 3mil; Surfaec Treatment: Immersion Gold;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series, ...; Material for PCB: Fr-4, High Tg Fr$, Halogen Free,; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series, ...; Material for PCB: Fr-4, High Tg Fr$, Halogen Free,; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series, ...; Material for PCB: Fr-4, High Tg Fr$, Halogen Free,; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;
Supplier Name	Shenzhen Xinmanda Printed Circuit Board Co., Ltd.	Shenzhen Jia Cheng Electric Co., Ltd.	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd
Select All

Contact Now

Hot Search