Through-Hole Technology
US$6.45-6.50 / Piece
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High Quality PCB for Refrigerator Video

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$6.50

1,000+ Pieces US$6.45

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Polyester Glass Fiber Mat Laminate
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Subtractive Process
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Shengyi, Kb, Nanya, Ilm
  • Transport Package Vacuum Packaging
  • Specification 120*65mm
  • Trademark XMANDA
  • Origin Made in China
  • Criteria Aql II 0.65
  • Hole Sizes 0.25mm
  • Bevel Edge Yes
  • Impedance 50/90/100 Ohm
  • Trace Width(Min.) 4mil
  • Surfaec Treatment Enig

Product Description

Specifications: Layers: 4 Thickness: 0.6-1.6mm Material: FR4 KB6160 Size: 120*65mm Surface treatment: ENIG Line width/spacing: 5/5mil Minimum aperture: 0.25mm Solder mask color: photosensitive green Finished copper thickness: 1/1 OZ Features: 1. The integration of the board ...

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Through-Hole Technology Comparison
Transaction Info
Price US $ 6.45-6.50/ Piece US $ 2.00-5.00/ Piece US $ 2.00-5.00/ Piece US $ 0.95-2.10/ Piece Negotiable
Min Order 10 Pieces 1 Pieces 1 Pieces 100 Pieces 5 Pieces
Trade Terms - - - - -
Payment Terms T/T T/T, Western Union, Paypal T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification - - - ISO9001, ISO16949, RoHS -
Management System Certification ISO 9001, ISO 14001, IATF16949 - - ISO 9001, ISO 14001, IATF16949 -
Trade Capacity
Export Markets - North America, Europe, East Asia(Japan/ South Korea) North America, Europe, East Asia(Japan/ South Korea) North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Australia
Annual Export Revenue - - - - -
Business Model OEM, ODM - - OEM, ODM -
Average Lead Time - - - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
-
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Enig;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 0.5-5oz;
Board Thickness: 1.6 ±0.1mm;
Minimum Hole: Minimum;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: 94V-0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Finestpcb;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 0.5-5oz;
Board Thickness: 1.6 ±0.1mm;
Minimum Hole: Minimum;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Impedance Control Accuracy: ±8%;
Minimum Solder Resist Opening: 1.5mil;
Structure: Standard;
Dielectric: Standard;
Material: Standard;
Application: Consumer Electronics;
Flame Retardant Properties: Standard;
Processing Technology: Standard;
Production Process: Standard;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Ckmcu;
Sku: 42213;
Place of Origin: China;
MOQ: 5;
Delivery Time: 7days;
Support Customization: Yes;
Supplier Name

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Finest Pcb Assembly Limited

China Supplier - Diamond Member Audited Supplier

Finest Pcb Assembly Limited

China Supplier - Diamond Member Audited Supplier

King Field Electronic Co., Ltd. (Shenzhen)

China Supplier - Diamond Member Audited Supplier

Shenzhen Chipskey Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier