Affordable Fiber Communication Board
US$0.55-0.60 / Piece
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About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$0.60

1,000+ Pieces US$0.55

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Shengyi, Kb, Nanya, Ilm
  • Transport Package Vacuum Packaging
  • Specification 33*88mm
  • Trademark XMANDA
  • Origin Made in China
  • Criteria Aql II 0.65
  • Hole Sizes 0.15mm/0.2mm
  • Bevel Edge Yes
  • Impedance 50/90/100 Ohm
  • Trace Width(Min.) 4mil
  • Surfaec Treatment Immersion Gold

Product Description

Specifications: Layers: 4 Thickness:1.6mm Material: FR4 KB6165 Size: 33*88mm Surface treatment: Immersion gold Line width/spacing: 4/4mil Minimum aperture: 0.25mm Solder mask color: Red Finished copper thickness: inner layer 1 OZ, outer layer 1 OZ Features: 1. The integration ...

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Affordable Fiber Communication Board Comparison
Transaction Info
Price US $ 0.55-0.60/ Piece US $ 2.50-15.50/ Piece US $ 1.00-2.00/ Piece US $ 1.00-2.00/ Piece US $ 15.00-20.00/ Piece
Min Order 10 Pieces 500 Pieces 100 Pieces 100 Pieces 100 Pieces
Trade Terms - - - - -
Payment Terms T/T L/C, T/T, Western Union, Paypal, Money Gram T/T T/T T/T
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, IATF16949, ISO 13485 ISO 9001 ISO 9001 ISO 9001
Trade Capacity
Export Markets - Domestic North America, South America, Eastern Europe, Southeast Asia, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time - Off-season: 1 Month(s)
Peak-season: 1-3 Month(s)
- - -
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.15mm/0.2mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Immersion Gold;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Hongzhou;
PCBA-Testing: X-ray, Aoi;
Mode of Production: SMT;
Metal Coating: Tin;
Layers: Multilayer;
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: HD;
PCB Layer: 6-Layers;
Min. Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Materials: Fr4;
Surface Finishing: Enig;
Test: Flying Probe;
Silkscreen: White;
Solder Mask Type: Green;
External Copper Thickness: 1oz;
Copper Thickness: 1-1/3oz;
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: HD;
PCB Layer: 2-Layers;
Min. Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Materials: Fr4;
Surface Finishing: Enig;
Test: Flying Probe;
Silkscreen: White;
Solder Mask Type: Green;
External Copper Thickness: 1oz;
Copper Thickness: 1-1/3oz;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: HD;
PCB Layer: 18-Layers;
Min. Line Width/Space: 0.08mm;
Min. Hole Size: 0.1mm;
Materials: Fr4;
Surface Finishing: Enig;
Test: Flying Probe/Electrical Logging;
Silkscreen: White;
Solder Mask Type: Green;
External Copper Thickness: 1oz;
Copper Thickness: 1-1/3oz;
Supplier Name

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Haodley Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Haodley Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Haodley Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier