What is Advanced High-Density 8-Layer PCB for Mobile Devices

Name: Advanced High-Density 8-Layer PCB for Mobile Devices
Uploaded: 2024-05-27T16:57:13+08:00
Description: Specifications: Layers: 8 Thickness:1.6mm Material: FR4 KB6160 Size:39*79mm Surface treatment: ENIG+OSP Line width/spacing: 0.102/0.102mm Minimum aperture: 0.2mm Solder mask color: Black Finished copp

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Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$3.20

1,000+ Pieces US$3.00

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand Shengyi, Kb, Nanya, Ilm
Transport Package Vacuum Packaging
Specification 39*79mm
Trademark XMANDA
Origin Made in China
Criteria Aql II 0.65
Hole Sizes 0.25mm
Bevel Edge Yes
Impedance 50/90/100 Ohm
Trace Width(Min.) 4mil
Surfaec Treatment Enig+OSP

Product Description

Specifications: Layers: 8 Thickness:1.6mm Material: FR4 KB6160 Size:39*79mm Surface treatment: ENIG+OSP Line width/spacing: 0.102/0.102mm Minimum aperture: 0.2mm Solder mask color: Black Finished copper thickness: 1/1 OZ Features: 1. The integration of the board design is very ...

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Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

Diamond Member Since 2023

Audited Supplier

Business Range Consumer Electronics, Electrical & Electronics, Instruments & Meters
Main Products PCB, Double-Sided PCB, Multilayer PCB, Printed Circuit Board, Aluminum PCB, PCB Assembly, PCBA, Flexible PCB, Electronic Component, PCB Circuit
OEM/ODM Availability Yes

Advanced PCB Technology Comparison

	Quick View Advanced High-Density 8-Layer PCB for Mobile Devices Contact Now	Quick View PCBA EMS Electronic Contract Manufacturing Electronic Manufacturing Services, PCBA Service Contact Now	Quick View Electronic EMS SMT DIP PCBA Assembly Service Factory with PCB Assembling Contact Now	Quick View Motherboard Multilayer PCB Rigid PCB&PCBA Assembly Service/PCB One Stop Service Contact Now	Mpu-2fk Industrial Control Card Main Board Power Supply Contact Now

Transaction Info
	Quick View Advanced High-Density 8-Layer PCB for Mobile Devices Contact Now	Quick View PCBA EMS Electronic Contract Manufacturing Electronic Manufacturing Services, PCBA Service Contact Now	Quick View Electronic EMS SMT DIP PCBA Assembly Service Factory with PCB Assembling Contact Now	Quick View Motherboard Multilayer PCB Rigid PCB&PCBA Assembly Service/PCB One Stop Service Contact Now	Mpu-2fk Industrial Control Card Main Board Power Supply Contact Now
Price	US $ 3.00-3.20/ Piece	US $ 2.50-15.50/ Piece	US $ 2.50-15.50/ Piece	US $ 2.50-15.50/ Piece	US $ 10.00-10,000.00/ Piece
Min Order	10 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	FOB, CFR, CIF, CIP, EXW
Payment Terms	T/T	T/T	T/T	T/T	T/T, Western Union
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025	ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025	ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025	-
Trade Capacity
Export Markets	-	North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	-	Off-season: 1 Month(s) Peak-season: 1 Month(s)	Off-season: 1 Month(s) Peak-season: 1 Month(s)	Off-season: 1 Month(s) Peak-season: 1 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Criteria: Aql II 0.65; Hole Sizes: 0.25mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 4mil; Surfaec Treatment: Enig+OSP;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fr4; Application: Consumer Electronics; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: Grandtop;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fr4; Application: Consumer Electronics; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: Grandtop;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fr4; Application: Consumer Electronics; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: Grandtop;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Communication; Flame Retardant Properties: HB; Mechanical Rigid: Fexible; Processing Technology: Delay Pressure Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: HK; Furnace Spares Package: Paper Box or Wood Box; Spare Parts Delivery Way: Fast Courier;
Supplier Name	Shenzhen Xinmanda Printed Circuit Board Co., Ltd.	Shenzhen Grandtop Electronics Co., Ltd.	Shenzhen Grandtop Electronics Co., Ltd.	Shenzhen Grandtop Electronics Co., Ltd.	Weifang Kingsa International Trade Co., Ltd.
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