Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Enig;
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Type: Rigid Circuit Board;
Material: Fr4-S1000-2;
Application: Security Engineer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: OSP;
Mini Hole Diameter: 0.3mm;
Borad Thickness: 1.6mm;
Count Layer: 4;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 5mil/4mil;
Special: Balck Printing Ink, Impedance Control;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Max Layer Counts: 40 Layer;
Max Copper Thickness: 14oz;
Mininum Line Width: 3mil;
Minimum Line Space: 3mil;
UL Certificate: Yes;
Sample Building: Yes;
Quickturn Service: Yes;
Country of Origin: China;
Packing: Vacuum Packing;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Max Layer Counts: 40 Layer;
Max Copper Thickness: 14oz;
Mininum Line Width: 3mil;
Minimum Line Space: 3mil;
UL Certificate: Yes;
Sample Building: Yes;
Quickturn Service: Yes;
Country of Origin: China;
Packing: Vacuum Packing;
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Type: Alarms and Motorcyles;
Dielectric: FR-4;
Material: Complex;
Application: Swing Gate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Ucontrol;
Temperature: -20°c-65°c;
MOQ: 100PCS;
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