Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Shengyi, Kb, Nanya, Ilm, Rogers;
Criteria: Aql II 0.65;
Hole Sizes: 0.3mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 8mil;
Surfaec Treatment: Enig;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Copper Thickness: 1oz;
Surface Finishing: Immersion Gold;
Solder Mask Type: Green;
Silkscreen: White;
Board Thickness: 1.6mm;
Min. Line Spacing: 0.2mm;
Min. Line Width: 0.2mm;
Layer: 2 Layer;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Copper Thickness: 1oz;
Surface Finishing: HASL;
Solder Mask Type: Green;
Silkscreen: White;
Board Thickness: 1.6mm;
Min. Line Spacing: 0.2mm;
Min. Line Width: 0.2mm;
Layer: 2 Layer;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Copper Thickness: 1oz;
Surface Finishing: OSP;
Solder Mask Type: Green;
Silkscreen: White;
Board Thickness: 1.6mm;
Min. Line Spacing: 0.2mm;
Min. Line Width: 0.2mm;
Layer: 2 Layer;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Copper Thickness: 1oz;
Surface Finishing: HASL;
Solder Mask Type: Green;
Silkscreen: White;
Board Thickness: 1.6mm;
Min. Line Spacing: 0.2mm;
Min. Line Width: 0.2mm;
Layer: 2 Layer;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
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